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WO/2017/017430A1 |
A tool swivel assembly for a machine tool comprises: a base (34) for mounting on a machine tool; a support shaft (6) in a fixed position and orientation relative to the base, the support shaft having a longitudinal reference axis (24); a...
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WO/2017/013837A1 |
A cutting device is provided with a first flange and a second flange secured to a rotary shaft in such a state as to sandwich a rotary blade. The first flange is provided with an annular holding part in close contact at the outer-periphe...
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WO/2017/005540A1 |
A positioning device (16) for a cylinder block (2) has a support element (20) which is pivotable about a pivot axis (23) by means of at least one electric drive motor (22). At least one clamping unit (35, 36) is arranged on the support e...
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WO/2016/209001A1 |
The present invention relates to a device for removing burrs from a synchronizer hub, and a burr removing method using same. The device is characterized by including: reverse introduction preventing means for preventing the reverse intro...
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WO/2016/207489A1 |
An apparatus (100) for cutting workpieces comprises a clamping mechanism (2) adapted to be fastened to said workpiece (1) rotatably therearound. The clamping mechanism (2) comprises a frame element (5) and first and second arms (6, 7) ex...
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WO/2016/208112A1 |
Provided are a wire saw device and a workpiece cutting method which are capable of efficiently collecting spattered slurry even in an intermediate stage of a workpiece cutting process and improving the surface quality of a cut workpiece....
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WO/2016/198533A1 |
The invention relates to a method and a machine for fine machining of a metal component (S), which comprises a central through-opening (S8) which has an inner surface (S9) which surrounds same and is to be fine machined, and at least one...
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WO/2016/185656A1 |
The present invention addresses the problem of obtaining a polishing device that can uniformly polish the surface of an object to be processed such as a wire rope, and with which work for mounting/dismounting on/from the object to be pro...
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WO/2016/178297A1 |
The present invention is a wire saw device characterized by comprising: a wire row formed of a wire which is wound around a plurality of wire guides and reciprocates in the axial direction; a nozzle that supplies a coolant or slurry to t...
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WO/2016/172751A1 |
The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported...
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WO/2016/171018A1 |
[Problem] To provide a method for producing fine silicon powder which allows for collection of high-purity flaky fine silicon powder from silicon cutting scraps generated during slicing of a silicon ingot, without using a mechanical pulv...
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WO/2016/169565A1 |
By, according to the invention, designing a surface treatment tool with a grinding head (16, 17) with cylindrical rollers (18), so that the tool (16, 17, 18) is balanced by weight because the tool's centre of gravity is close to the tool...
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WO/2016/145472A1 |
Disclosed is a method for the automated surface processing of a workpiece (301). According to an embodiment of the invention, the method comprises the generation of a contact force (FK) between a rotating tool (202) and a workpiece (301)...
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WO/2016/146343A1 |
A method is described to produce a fixed abrasive saw wire (104) by electrolytic deposition of abrasive particles pre-coated with a first metal on an elongated substrate wire (104, 202). The method is specific in that in the initial fixa...
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WO/2016/145926A1 |
An intelligent grinding device for short-pulse electric-smelting chip removing and cooling, comprising a diamond grinding wheel (1), a pulse power supply (10), a dynamometer sensor (4), a thermocouple (3) provided in a small hole of a wo...
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WO/2016/142762A1 |
The invention relates to a system for the polishing treatment of inner walls of aquatic enclosures (1), comprising at least one tank (21) of abrasive mixture and at least one surface treatment head (30) which communicates fluidically wit...
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WO/2016/142822A1 |
Apparatus (14) for grinding the edges of glass sheets comprising supporting means (20) designed to support a sheet (22) being machined, and at least one machining head (18) provided with grinding means (18). The apparatus (14) comprises ...
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WO/2016/120715A1 |
The invention relates to a sanding dust suction device for a movable floor sanding machine (1) with at least two horizontal sanding tool retaining devices (21, 22), in particular in the shape of discs, which are driven in a rotating mann...
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WO/2016/117294A1 |
The present invention provides a method for cutting a workpiece into wafer shape, by winding a wire about a roller that has a plurality of grooves, and placing the wire, while driven, against the workpiece and at the same time supplying ...
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WO/2016/103854A1 |
A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to diss...
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WO/2016/095939A1 |
The invention relates to a device and a method for machining an optical lens, in particular for machining the edges of an optical lens. The device has a measuring device, a machining device, a loading device, an unloading device, an inte...
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WO/2016/091787A1 |
A method of cleaning deposited material from a molding surface (10) of a mold (1) for forming ophthalmic lenses comprises the steps of: - bringing a cleaning head (20) into contact with the molding surface (10), the rotational axis (22) ...
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WO/2016/071188A1 |
The invention relates to a device comprising a turning unit (14) for turning a workpiece. According to the invention, the turning unit (14) comprises a driveable movable turning body which has contact means (18) which can move with the m...
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WO/2016/058663A1 |
The invention relates to a device (10) for finely machining optically effective surfaces on, in particular, eyeglass lenses as workpieces, comprising a workpiece spindle (14), which protrudes into a working space (13) and by means of whi...
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WO/2016/050858A1 |
The invention relates to an apparatus (10) for sharpening scraping edges (2) of a scraper roller (1), said apparatus comprising a tool (6) for processing said scraping edges (2) of the scraper roller (1), a computer processing arrangemen...
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WO/2016/052143A1 |
A grinding device (G) for travel paths (11) on which the running wheels of a rail-type vehicle roll is provided with: grinders (20) for grinding the surface layer of the travel paths (11); a frame (30) on which the grinders (20) are prov...
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WO/2016/051668A1 |
This ingot cutting method is characterized in that an ingot is cut by setting, at the time of cutting a cut start portion of the ingot, a tensile force to be applied to a wire on the side fed out from a bobbin higher than a reference ten...
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WO/2016/032883A1 |
A damped abrasive cutter having a machine attaching end; an abrasive surface comprising abrasive particles disposed in a binder; a central damping body connecting the machine attaching end to the abrasive surface. The central damping bod...
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WO/2016/027540A1 |
According to an embodiment of the present invention, a target material is a board-like ceramic material. In the target material, surface roughness (Ra) of a sputtering surface, with which sputtering is to be performed, is 0.5-1.5 μm, an...
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WO/2016/019997A1 |
The invention relates to a finishing device (30) for finish machining of a workpiece (42), in particular of a crankshaft or a camshaft, comprising a workpiece holder and a rotary drive for rotating the workpiece (42) about the workpiece ...
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WO/2016/010422A1 |
Apparatus (1) for grinding material such as present in a blast furnace (3) hearth bottom (2), which apparatus comprises a grinder (4) for carbonaceous materials such as carbon blocks and/or bricks, which apparatus further comprises a rob...
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WO/2016/005918A1 |
Described is a sanding machine for sanding panels, comprising a supporting structure (2), a sanding unit (12) supported by the supporting structure (2), a surface (9) for supporting and sliding of the panels located beneath the sanding u...
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WO/2016/000819A1 |
The invention relates to a grinding machine for grinding a surface of a workpiece, wherein the grinding machine comprises a plurality of grinding elements (2) and at least one drive device, by means of which the plurality of grinding ele...
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WO/2016/002707A1 |
Provided are: a gallium oxide substrate production method whereby the occurrence of defects can be reduced and a gallium oxide substrate can be obtained from an ingot of monocrystalline gallium oxide; and a gallium oxide substrate having...
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WO/2015/194353A1 |
[Problem] To provide a ceramic component manufacturing method capable of effectively removing burrs occurring inside the flange portions without causing damage. [Solution] A ceramic core burr removing method is a method for removing burr...
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WO/2015/186803A1 |
The purpose of the present invention is to provide an adhesive agent composition for temporary fixation such that members fixed thereby do not detach during processing and do not separate during a post-processing cleaning step, specifica...
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WO/2015/183861A1 |
PROBLEM: To provide a finishing method for a painted surface that can reduce the number of processing steps, and that can shorten the finish polishing time and reduce the polishing area. RESOLUTION MEANS: The painted surface finishing me...
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WO/2015/182023A1 |
The present invention provides an abrasive grain-fixed wire having a core wire surface on which abrasive grains are fixed, wherein the abrasive grain number density, which is the number of the abrasive grains per unit area, on the surfac...
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WO/2015/178188A1 |
A semiconductor wafer (1) is provided with a substrate (23), a GaN-based semiconductor film (24) laminated on the substrate (23), a plurality of element regions provided on the GaN-based semiconductor film (24), a dielectric film (25) la...
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WO/2015/151408A1 |
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working flui...
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WO/2015/130594A1 |
Glass processing apparatus each include a first sheet guide device and a second sheet guide device with a gap configured to receive a glass sheet. In one example, an adjustment member can move the first sheet guide device relative to the...
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WO/2015/130586A1 |
A glass treatment apparatus comprise at least one upstream working device including a working wheel configured to rotate such that a working surface of the working wheel machines a surface portion of a glass sheet. The glass treatment ap...
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WO/2015/128210A1 |
The invention provides a grinding machine for the complete machining of workpieces, in particular gearwheels for transmissions, on both planar sides and within a central bore on one and the same machine, and a method which is carried out...
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WO/2015/125366A1 |
A silicon wafer manufacturing method comprising: a wire traveling step for rotating a plurality of main rollers around which a corrugated wire (7) is helically wound to cause the corrugated wire (7) to travel in a direction approximately...
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WO/2015/119343A1 |
The present invention provides a saw wire having asymmetrical crimps. The saw wire comprises an asymmetrical unit crimp that is continuously formed in a zigzag shape, wherein the asymmetrical unit crimp comprises a first portion and a se...
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WO/2015/119344A1 |
The present invention provides a structured saw wire maintaining a crimp property under slicing tension. The structured saw wire maintaining a crimp property under slicing tension comprises a unit crimp that is continuously formed in a z...
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WO/2015/109909A1 |
Disclosed is a PCB grinding machine, comprising a workbench (100), a first guide rail (200), two second guide rails (300), a third guide rail (400), a grinding assembly (500) and a servo system (600). The two second guide rails (300) are...
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WO/2015/105175A1 |
Provided is a method for cutting a workpiece which comprises cutting a workpiece except silicon through use of a resin-coated saw wire that has a resin coating on the surface of a steel wire, which causes neither the abrasion of the resi...
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WO/2015/097989A1 |
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is...
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WO/2015/097985A1 |
The present invention is a workpiece cutting method comprising measuring a crystal axis orientation by holding a workpiece with a workpiece holding tool (1), followed by setting on a wire saw the workpiece holding tool still holding the ...
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