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WO/2022/196132A1 |
The present invention provides a method for manufacturing a semiconductor device equipped with a semiconductor substrate, the method comprising: an attachment step for attaching a protective tape on a first surface of a semiconductor sub...
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WO/2022/188055A1 |
The present invention relates to a method for manufacturing a glass wafer of high quality, a glass wafer, which preferably can be or is manufactured by such a method, a glass part ele-ment, which preferably is or can be a part of such a ...
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WO/2022/181715A1 |
A magnetic disk substrate of an embodiment comprises a pair of main surfaces, and an outer peripheral edge surface. In the magnetic disk substrate, the outer peripheral edge surface has a pair of chamfered surfaces connecting to the main...
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WO/2022/170697A1 |
A jet strengthening and polishing integrated apparatus and process for performing surface strengthening on a workpiece to be machined. The jet strengthening and polishing integrated apparatus comprises: a storage (1) for storing water an...
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WO/2022/170015A1 |
A chemical mechanical polishing composition for polishing a substrate including a silicon carbonitride layer, the composition comprising, consisting essentially of, or consisting of a water based liquid carrier, anionic colloidal silica ...
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WO/2022/151738A1 |
Disclosed is a micro-nano bubble enhanced plasma polishing method. By means of the method, a micro-nano bubble generating device is used for conveying an electrolyte solution containing micro-nano bubbles into a working tank; in the work...
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WO/2022/134866A1 |
An ultrasonic conduction grinding module, comprising a vibration source (1), which comprises a plurality of piezoelectric plates (11), and a conductive plate group (12) having at least one first conductive plate (121) and at least one se...
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WO/2022/130800A1 |
A wafer polishing method according to the present invention comprises: a step for obtaining a first correlation, which is a correlation between alkali concentration and chemical polishing rate, using a plurality of polishing solutions ha...
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WO/2022/132371A1 |
A polishing station for polishing a substrate using a polishing slurry is disclosed. The polishing station includes a substrate carrier having a substrate receiving surface and a rotatable platen having a polishing pad disposed on a plat...
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WO/2022/121012A1 |
The present invention relates to the technical field of semiconductor material processing, and in particular to a method for processing a large-size ultra-thin high-precision lithium niobate wafer. The method comprises the steps of slici...
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WO/2022/105078A1 |
A shoe sole roughing trajectory planning method based on a clustering algorithm. The method comprises the following steps: acquiring point cloud data of a shoe sole; taking a normal vector corresponding to the coordinates of a central po...
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WO/2022/095456A1 |
A method for grinding a diamond substrate, the method comprising grinding the diamond substrate by means of a grinding disk on which a soft abrasive capable of performing a solid phase chemical reaction with diamond is consolidated, and ...
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WO/2022/077614A1 |
A method for improving surface evenness of electroplated platinum and a polishing device used by the method. The method comprises the following steps: S1. performing drilling wave crest polishing; S2. performing visual inspection and det...
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WO/2022/076222A1 |
The disclosure relates to methods for compensating for crystal structures differential material removal rates in sub-aperture figuring. A computing machine receives an input related to a substrate crystal structure. The computing machine...
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WO/2022/063369A1 |
There is described a method and an apparatus for treatment of a surface of an elongat- ed structure, e.g. a wind turbine blade, by simultaneous abrading and cleaning of the structure. The apparatus comprises an abrasive head which compri...
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WO/2022/060735A1 |
The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a surfactant, (c) an iron cation, (d) optionally a ligand, and (e) water, wherein the silica abrasive has a negative zeta potential...
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WO/2022/052931A1 |
The present invention provides a building grinding method, apparatus, and system, a processor, and a storage medium. A building surface grinding method comprises: detecting a plurality of defect positions of a building surface; determini...
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WO/2022/041355A1 |
An environmentally-friendly finishing machining method for silicon nitride ceramic balls, belonging to the technical field of ceramic material machining. During a finishing machining process, a water-based circulating liquid is used to r...
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WO/2022/037048A1 |
Disclosed in the present invention are a polishing apparatus for the inner wall of a pipe and a working method of the polishing apparatus. The polishing apparatus for the inner wall of a pipe comprises: a workbench; a support frame fixed...
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WO/2022/028388A1 |
A grinding tool kit for finish machining of a rolling surface of a bearing roller, and an apparatus and a method. The apparatus comprises a main machine, an external circulation system, a grinding tool kit and a grinding tool kit clamp. ...
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WO/2022/011978A1 |
A boring and mounting technique for ship shaft and rudder systems, comprising the following steps: tail pipe assembling and segmented mounting; laser positioning and calibration of the ship shaft and rudder systems; rough boring, fine bo...
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WO/2022/013766A1 |
A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed retriever that retrieves a current rotational speed of a grinder in the robotic grinding system. The system ...
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WO/2022/007084A1 |
A processing method without intermediate-frequency error under a magnetorheological polishing magic angle-step. The method comprises the steps of: firstly, performing measurement to obtain a magnetorheological removal function, and also ...
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WO/2022/003489A1 |
Process of grinding and polishing flank surfaces (40) of teeth (50) of toothed wheels (60), comprising the steps of a) providing a grinding device (6), a polishing device (7), a dynamic positioning device (8) and a toothed wheel (60); b)...
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WO/2021/261291A1 |
A female screw is provided at the tip of a rotating shaft (8) of an ultrasonic processing apparatus (1). Meanwhile, a bar screw (6) having a hexagonal hole and a front mass (3) are produced as an integrated metal part. A Langevin type ul...
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WO/2021/253935A1 |
A housing assembly, a preparation method therefor and a mobile terminal, the housing assembly comprising a glass body, the glass body having a first surface, and the first surface having a haze of less than or equal to 90% and a surface ...
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WO/2021/253589A1 |
A processing and manufacturing method capable of customizing a high-precision potassium tantalate niobate (KTa1-xNbxO3, where 0
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WO/2021/248858A1 |
A PLC-based automatic grinding constant pressure control method, comprising: setting a required grinding rotating speed and a required grinding pressure for an object to be ground; generating a control instruction according to the requir...
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WO/2021/242755A1 |
Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic oxide particles...
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WO/2021/238792A1 |
The present invention relates to the field of machining. Disclosed are a magnetic grinding apparatus and a magnetic grinding control method. The apparatus comprises: a magnet platform of a ground workpiece fixing table is connected to an...
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WO/2021/241505A1 |
Provided is a polishing method which makes it possible to efficiently provide a surface that is prevented from the occurrence of subsurface damages with high accuracy in a high-hardness material. A polishing method provided by the presen...
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WO/2021/232735A1 |
Disclosed are a machining method and machining device having high efficiency and low damage. The machining method having high efficiency and low damage comprises: providing a workpiece (300) and a machining unit (400); and the machining ...
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WO/2021/235067A1 |
The present invention is a substrate wafer production method in which a substrate wafer is produced by preparing a wafer that has a first principal surface and a second principal surface, forming a flattened resin layer on the second pri...
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WO/2021/225020A1 |
The present invention is a surface grinding method for a wafer, wherein: a wafer is prepared, the wafer having a first primary surface and a second primary surface on the side opposite the first primary surface, and having an edge part p...
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WO/2021/212788A1 |
Disclosed are a wall surface sanding path planning method and apparatus, and a device and a medium. The method comprises: acquiring protruding points (1-N) of a wall surface to be sanded, and dividing said wall surface into at least two ...
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WO/2021/208283A1 |
The present invention relates to an ultrasonic vibration platform for processing a large part, and an operating process therefor. Said platform comprises: a piezoelectric ceramic transducer, a longitudinal vibration amplitude transformer...
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WO/2021/205740A1 |
The present invention is a wafer polishing method, for performing corrective polishing by pressing a wafer onto a polishing cloth while continuously supplying a water-containing polishing composition in order to correct the shape of a po...
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WO/2021/200512A1 |
Provided is a method for producing an intermediate glass plate comprising the steps for defect formation, separation, and polishing. In the defect forming step, a laminate of glass raw plates is irradiated with a laser beam from one side...
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WO/2021/202169A1 |
A grinder/polisher comprises a specimen holder, a platen, an actuator configured to move at least one of the specimen holder and the platen, an input device, a machine readable storage device, and a controller. The input device includes ...
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WO/2021/184480A1 |
A rocker arm type polishing device and method for plane part full-caliber deterministic polishing. The rocker arm type polishing device for plane part full-caliber deterministic polishing comprises a control system, a base (1), a lifting...
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WO/2021/184635A1 |
Disclosed is an ultrasonic vibration platform device for assisting in honing of an engine oil nozzle hole. The ultrasonic vibration platform device comprises a vibration platform adapter shell, a piezoelectric transducer, an ultrasonic p...
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WO/2021/169316A1 |
Disclosed is a device for polishing an intraocular lens by using an electrorheological effect. The device comprises a supporting plate (14), an electric motor (16), a conductive slip ring (18), an outer sleeve (20), a tool shaft (22), a ...
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WO/2021/169178A1 |
The present invention belongs to the field of machining technology, and in particular relates to an ultra-precision machining method and device for a quartz harmonic oscillator. Firstly, the outer surface of a quartz harmonic oscillator ...
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WO/2021/167242A1 |
The present invention analyzes a processing program code in an NC machine tool so as to generate and store polishing processing route information, sets amplitude, vibration speed and vibration distance according to the polishing processi...
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WO/2021/164298A1 |
A magnetorheological finishing machining system based on a mechanical arm, comprising a mechanical arm having multiple joints connected in series and a magnetorheological liquid circulation system distributed on the mechanical arm. The m...
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WO/2021/135452A1 |
A sub-aperture center liquid supply optical surface machining tool comprising an elastic coupling (1), a polishing disk (3) and a polishing pad (5), wherein two ends of the elastic coupling (1) are connected to the polishing disk (3) and...
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WO/2021/129124A1 |
An electro-Fenton and cluster magnetorheological composite grinding and polishing device and method, comprising a base (1), a magnet cluster (2), a rotation transmission assembly (3) for driving the magnet cluster (2) to rotate, a revolu...
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WO/2021/120329A1 |
Disclosed is a rotary ultrasonic machining device capable of expanding bandwidth, the device comprising a transducer (1), a cutter (2) and a combined cutter holder (3), wherein one end of the combined cutter holder (3) is connected to th...
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WO/2021/122819A1 |
An ophthalmic lens comprising a first optical surface, an opposing second optical surface, and an edge surface connecting the first optical surface and the second optical surface is provided. The ophthalmic lens further comprises a coati...
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WO/2021/100705A1 |
Provided are a machining device and a machining method with which machining defects in machining, particularly, in drilling can be reduced and machining efficiency can be improved even when a pressing force of a tool during machining is ...
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