| Document |
Document Title |
|
WO/2020/067914A1 |
A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modifi...
|
|
WO/2020/051943A1 |
A grinding system for eliminating crack sources of an inner tapered bore of a motor rotating shaft and a grinding method therefor; the grinding system comprises a movable device (1), a pneumatic gun (2), and a clamping device; the movabl...
|
|
WO/2020/032146A1 |
This substrate for magnetic disks, which is in the form of a disk, has a diameter D of 85 mm or more; the plate thickness T of this substrate is 0.6 mm or less; and this substrate uses a material that has a Young's modulus E of 90 GPa or...
|
|
WO/2020/032106A1 |
[Problem] To provide a local polishing technique that stabilizes the volume of processing by means of local polishing, that can achieve a high level of corrective space resolution, and that is preferable for corrective polishing. [Soluti...
|
|
WO/2020/006053A1 |
A fabric treatment device including a base having a perimeter sidewall forming an interior. A bottom plate is removeably secured to the base. A carriage slide is operably connected to the base, and the carriage slide has an opening exten...
|
|
WO/2019/243914A1 |
A system for magnetic abrasive finishing of a workpiece may include a magnetic abrasive brush that may include a plurality of magnetic/abrasive particles and an electromagnet configured to apply a magnetic field on the plurality of magne...
|
|
WO/2019/240677A2 |
The invention relates to a composition of vitamin C and vitamin E with rifampicin, which has a broad activity spectrum and may be used for any wound, cut, fistula, and fissure that are either infected or at risk of being infected, as wel...
|
|
WO/2019/237910A1 |
A rough-and-fine integrated progressive grinding method for a non-slewing optical array, comprising step 1: respectively designing and manufacturing structural outlines of a precisely structured rough grinding diamond grinding wheel (2-1...
|
|
WO/2019/239013A1 |
The disclosed solution comprises a method of abrading the surface of a workpiece. The method comprises providing a workpiece (3), an abrading apparatus (14) with a backing pad (10) configured to receive an abrading plate (2), an abrading...
|
|
WO/2019/240680A2 |
The present invention relates to a section handling machine with a rotary mechanism ( 1 ), which is located on a production bench and is made from various materials, which can be moved around and processed at a desired angle and depth. T...
|
|
WO/2019/233174A1 |
A polishing method for a light-emitting element. An energetic particle is used to subject a light-emitting element to radiation with an increasing energy gradient, such that damage is homogeneously inflicted on a phase A of the light-emi...
|
|
WO/2019/230883A1 |
[Problem] To provide an ultrasonic vibration application tool comprising a Langevin ultrasonic transducer that is incorporated into an ultrasonic machining device and is suitable for generating circular traveling waves. [Solution] An ult...
|
|
WO/2019/223338A1 |
Disclosed is a trochoid-feed-path-based scratch test method for a hard and brittle material. According to an experimental scheme, a trochoid scratch feed path line is self-designed. A horizontal setting range of experimental factors is e...
|
|
WO/2019/211719A1 |
The present disclosure provides abrasive articles that include an abrasive layer having a contact surface, a first layer coupled to the abrasive layer, and a second layer coupled to the first layer. The first layer is configured to provi...
|
|
WO/2019/191848A1 |
An apparatus may include: a first at least one piezoelectric actuator operable to vibrate a tool in a first lateral direction; and a second at least one piezoelectric actuator operable to vibrate the tool in a second lateral direction. A...
|
|
WO/2019/181269A1 |
[Problem] The purpose of the present invention is to solve the contradictory problems of suppressing etching while maintaining the grinding speed during germanium grinding. [Solution] This germanium dissolution inhibitor comprises a comp...
|
|
WO/2019/181443A1 |
The present invention is a method for producing a silicon wafer, which comprises a dry etching step between a rough polishing step and a final polishing step, and which is characterized in that a silicon wafer after the rough polishing s...
|
|
WO/2019/177092A1 |
[Problem] To achieve: a diamond crystal polishing method capable of removing a process-modified section including dislocations from a main surface; and a diamond crystal in which the same process defect section has been removed from a ma...
|
|
WO/2019/164449A1 |
Disclosed is a method of reducing surface unevenness of a semiconductor wafer (100). In a preferred embodiment, the method comprises: removing a portion of a deposited layer and a protective layer thereon using a first slurry to provide ...
|
|
WO/2019/153771A1 |
Disclosed is a method for grinding an iron-chromium-aluminum ternary alloy ingot profile, the method comprising the following steps: (1) carrying out rough grinding on a surface; (2) carrying out rough grinding on a weld joint; (3) carry...
|
|
WO/2019/151185A1 |
In the present invention, when a glass blank is being cut out from a glass plate, first laser light is moved relative to the glass plate such that a focal position of the laser light is located in the interior of a plate thickness direct...
|
|
WO/2019/149165A1 |
An efficient ultra-precise shear thickening and chemical synergy polishing method, comprising the following steps: 1) fixing workpieces (3) to a polishing and fixing disc (31) of implementation equipment; 2) preparing an efficient ultra-...
|
|
WO/2019/149767A1 |
The present invention relates to a dressing apparatus (100) for dressing a grinding wheel (10) and a method for dressing the grinding wheel (10) with such a dressing apparatus (100), whereas the dressing apparatus (100) comprises a dress...
|
|
WO/2019/141855A1 |
A method for grinding and/or polishing a defect (1) in the surface coating of a workpiece, wherein a grinding or polishing disc held on a tool is guided with pressure over the defect (1) with orbital, rotating and/or vibrating movements,...
|
|
WO/2019/127024A1 |
A method for robotic machining is disclosed. The method includes determining a first designed machining path based on a modeled surface for a target surface to be machined (210). The method also includes causing a robot to machine the ta...
|
|
WO/2019/109920A1 |
Provided is a nano-fluid minimum quantity lubrication grinding apparatus with a grinding fluid infiltration microchannel assisted by ultrasonic vibration. The nano-fluid minimum quantity lubrication grinding apparatus comprises: an ultra...
|
|
WO/2019/108826A1 |
A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a...
|
|
WO/2019/089440A1 |
A surgical clip may include a wire body having first and second free end portions. The surgical clip may also include first and second leg members connected by a hinge portion. The first leg member may include first and second segments o...
|
|
WO/2019/088209A1 |
According to the present invention, in a particle size distribution for a cerium oxide contained in a polishing liquid as obtained by a laser diffraction/scattering method, D5 is 1 μm or less, and the difference between D95 and D5 is 3 ...
|
|
WO/2019/080598A1 |
A ceramic tile polishing device and method, said device comprising a control system, a ceramic tile feeding system and a ceramic tile polishing system, the ceramic tile polishing system comprising polishing group units, cross beam swing ...
|
|
WO/2019/077687A1 |
This silicon wafer polishing method includes a final polishing step comprising a preliminary stage polishing step, and, thereafter, a finishing polishing step. The preliminary stage polishing step comprises first supplying, as the polish...
|
|
WO/2019/069713A1 |
The present invention makes it possible to manufacture a sputtering target for which abnormal discharge does not arise easily. The manufacturing method for a sputtering target performs multistage abrasive finishing on the sputtering surf...
|
|
WO/2019/052724A1 |
The invention relates to a method for fine machining a cylindrical workpiece surface (16) of a workpiece blank (14) by means of a fine machining tool (26). Said method comprising the following steps: generating a relative rotational move...
|
|
WO/2019/047683A1 |
A smart polishing method, comprising the following steps: a robot moving according to a predetermined trajectory, so as to enable a polishing tool, which is connected to a floating part of a floating polishing structure or a front portio...
|
|
WO/2019/016495A1 |
A method for applying colour to a spectacle lens (300); (400); (500) having a front surface (310); (410); (510), a back surface (320); (420); (520) opposite the front surface and a peripheral surface (330); (430); (530) surrounding the l...
|
|
WO/2019/000315A1 |
Provided are a printing process for an identification plate (21) of a hair clipper. The identification plate (21) is made of a resilient plastic material. The printing process comprises the following specific steps: a. an injection moldi...
|
|
WO/2018/230328A1 |
The present invention provides: a surface treatment method by which a coating film excellent in terms of appearance improvement and durability can be formed on a coated surface at one time by easy application, irrespective of worker's ab...
|
|
WO/2018/227378A1 |
A device for precisely machining an outer cylindrical surface of a plate part by using a polishing technology on a polishing machine or a grinding table comprises a circular bottom plate (1), oblique guide rails (3), stop blocks (8), pre...
|
|
WO/2018/216720A1 |
Provided is an ultrasonic machining apparatus that is capable of improving microfabrication machining precision with respect to a workpiece. This ultrasonic machining apparatus 10 comprises: a base 12; an ultrasonic unit 18 that has a st...
|
|
WO/2018/216719A1 |
Provided is a shower head processing tool which can inhibit pins from falling off due to ultrasonic vibrations. A horn (10) comprising a base (12) and pins (14) that are inserted and fitted into holes (12a) provided in one main surface o...
|
|
WO/2018/216721A1 |
Provided is an abrasive particle recovery system for an ultrasonic processing system in which it is possible to recover abrasive particles from a suspension to be discarded and to reuse said abrasive particles. An abrasive particle recov...
|
|
WO/2018/209034A1 |
The current invention proposes sharpening thin hardened metal blades with the hard turning process using a holder designed to hold the blades in a firm and stiff manner and a ceramic cutting tool held in a fixture. Generally, the cutting...
|
|
WO/2018/206454A1 |
The invention relates to a method and a grinding and eroding machine (10) for machining a workpiece (14). Here, a combined grinding and eroding tool (12) is used, which is used in the same setup for eroding the workpiece (14) and for sub...
|
|
WO/2018/172584A1 |
The ultrasonic vibration-assisted ball burnishing tool comprises a burnishing head (1) including a burnishing ball (25) supported on a head body (10) and an ultrasonic vibration transmission unit (2) including one or more piezoelectric c...
|
|
WO/2018/147445A1 |
[Problem] To provide an ultrasonic vibration application tool which is suitable for incorporating into an ultrasonic processing device and which is provided with a Langevin type ultrasonic vibrator, wherein highly-efficient use of the ul...
|
|
WO/2018/133626A1 |
A method and a device for magnetic grinding of an internal surface of a metallic capillary tube. The method comprises the following steps: securing a metallic capillary tube (8) to undergo grinding on a metallic capillary tube installati...
|
|
WO/2018/136684A1 |
A method of machining a workpiece including: supporting the workpiece in a position between a pair of pots connected to a rounding machine, each of the pair of pots may include a first end, a second end opposite the first end, an outer r...
|
|
WO/2018/131771A1 |
The present invention relates to a peening position control technology of an ultrasound peening system, comprising: an ultrasound wave generation unit for generating an ultrasound wave; an ultrasound wave radiation unit arranged to make ...
|
|
WO/2018/122523A1 |
The invention concerns a device (100) for treating a metal part (1) having an outer surface (1-1), comprising: - a chamber (11), - a vibration module (12) comprising: ▪ a generator (12-1) for generating an electric signal at ultrasonic...
|
|
WO/2018/116558A1 |
Provided are a method for polishing a silicon wafer and a method for manufacturing a silicon wafer which are capable of suppressing the occurrence of a step-shaped micro defect. This method for polishing a silicon wafer is characterized ...
|
