Title:
TERMINATION CIRCUIT SUBSTRATE, PACKAGE FOR MOUNTING ELECTRONIC COMPONENT, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/234306
Kind Code:
A1
Abstract:
This termination circuit substrate comprises a dielectric substrate, a ground conductor portion, a signal conductor portion, a first resistor portion, and a second resistor portion. The ground conductor portion includes, positioned in order, a first ground conductor line, a second ground conductor line, a third ground conductor line, and a fourth ground conductor line. The signal conductor portion includes a first signal line positioned between the first ground conductor line and the second ground conductor line, and a second signal line positioned between the third ground conductor line and the fourth ground conductor line. The first resistor portion includes a first resistor connecting the first ground conductor line and the first signal line, a second resistor connecting the second ground conductor line and the first signal line, a third resistor connecting the third ground conductor line and the second signal line, and a fourth resistor connecting the fourth ground conductor line and the second signal line. The second resistor portion connects the second ground conductor line and the third ground conductor line.
Inventors:
KAWAZU YOSHIKI (JP)
Application Number:
PCT/JP2023/020127
Publication Date:
December 07, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01P1/26; H01L23/02; H01S5/022
Foreign References:
| KR101462391B1 | 2014-11-17 | |||
| US20050128022A1 | 2005-06-16 | |||
| JP2008085699A | 2008-04-10 |
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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