Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/070309
Kind Code:
A1
Abstract:
To properly remove the edge portion of a first substrate in consideration of a non-joint region in a notch portion formed on the first substrate in a polymeric substrate in which the first substrate and a second substrate are joined to each other. [Solution] A substrate processing method for processing a polymeric substrate in which a first substrate and a second substrate are joined to each other, the first substrate including a notch formed by cutting a part of the edge of the first substrate to be removed, a joined portion that is joined to the second substrate, and a non-joint portion that is not joined to the second substrate, the method comprising: forming an edge modifying layer, which serves as a starting point of peeling of the edge portion, by laser light radiation along the boundary between the edge portion of the first substrate and the central portion of the first substrate; and peeling the edge portion from the polymeric substrate with the edge modifying layer serving as a starting point. When the edge modifying layer is formed, the formation position of the edge modifying layer corresponding to the formation portion of the notch is determined on the basis of information about the non-joint portion.
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Inventors:
YAMASHITA YOHEI (JP)
MORI HIROTOSHI (JP)
NAKAMURA YOSUKE (JP)
SHIBA KAZUHIRO (JP)
IWANAGA KAZUYA (JP)
HISANO KAZUYA (JP)
MORI HIROTOSHI (JP)
NAKAMURA YOSUKE (JP)
SHIBA KAZUHIRO (JP)
IWANAGA KAZUYA (JP)
HISANO KAZUYA (JP)
Application Number:
PCT/JP2023/029716
Publication Date:
April 04, 2024
Filing Date:
August 17, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B23K26/53; B28D5/00
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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