Title:
SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/153174
Kind Code:
A1
Abstract:
Provided is a technology with which it is possible to suppress the effect of unwanted reflected light, to thereby monitor an object to be monitored with higher accuracy. A substrate processing apparatus (100) comprises: a chamber (10); a substrate holding unit (20); an illumination unit (71); a polarization filter (73); a filter drive unit (74); a camera (70); and a control unit (9). The illumination unit (71) irradiates an imaging region including an object to be monitored in the chamber (10), with illuminating light. The filter drive unit (74) rotates the polarization filter (73) to a rotational position corresponding to the object to be monitored in the imaging region, to reduce unwanted reflected light corresponding to the object to be monitored by means of the polarization filter (73). The camera (70) captures an image of the imaging region through the polarization filter (73), and generates captured image data. The control unit (9) controls the filter drive unit (74), and monitors the object to be monitored on the basis of the captured image data generated by the camera (70).
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Inventors:
SHIMIZU SHINJI (JP)
Application Number:
PCT/JP2023/001713
Publication Date:
August 17, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/02; H01L21/027; H01L21/306
Foreign References:
| JP2015173148A | 2015-10-01 | |||
| JP2008014768A | 2008-01-24 | |||
| JP2007213016A | 2007-08-23 | |||
| JP2021044417A | 2021-03-18 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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