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Title:
STRUCTURAL BODY AND METHOD FOR PRODUCING STRUCTURAL BODY
Document Type and Number:
WIPO Patent Application WO/2024/034544
Kind Code:
A1
Abstract:
A structural body comprising: a metallic member having a surface in which at least one fine structure selected from among dendritic structures, acicular structures, and particular structures has been formed; and a resinous member bonded to the surface of the metallic member in which the fine structure has been formed. The resinous member has a tensile modulus at 23°C of 500 MPa or less or includes a heat-curable elastomer.

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Inventors:
KIMURA KAZUKI (JP)
SHISHIDO KEISUKE (JP)
OKUBO TAICHI (JP)
SHINZO SHOTA (JP)
Application Number:
PCT/JP2023/028643
Publication Date:
February 15, 2024
Filing Date:
August 04, 2023
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B15/08; B32B3/30
Domestic Patent References:
WO2022019339A12022-01-27
WO2015087722A12015-06-18
Foreign References:
JP2019018547A2019-02-07
JP2018129197A2018-08-16
JP2016002654A2016-01-12
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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