Title:
SOLID ELECTROLYTIC CAPACITOR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/038316
Kind Code:
A1
Abstract:
Provided is a manufacturing method for a solid electrolytic capacitor chip in which a solid electrolytic capacitor element is placed at one face (front face) of a cathode lead of a lead frame which serves as a cathode terminal, the anode and the cathode of the solid electrolytic capacitor element are electrically connected to the anode terminal and the cathode terminal of the lead frame, respectively, and then an exterior resin is injected from a resin injection opening of a mold by transfer molding to seal the opening, wherein the injection opening is provided at a position where the exterior resin injected from the injection opening branches and flows towards both the front face side and the other face (rear face) side of the lead frame. According to the present invention, a plurality of capacitor elements can be kept horizontal with respect to each other and the openings of the capacitor elements can be completely sealed in transfer molding.
Inventors:
NAITO KAZUMI (JP)
TAMURA KATSUTOSHI (JP)
SUZUKI MASAHIRO (JP)
TAMURA KATSUTOSHI (JP)
SUZUKI MASAHIRO (JP)
Application Number:
PCT/JP2013/070601
Publication Date:
March 13, 2014
Filing Date:
July 30, 2013
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
H01G9/00; B29C45/02; H01G9/08; H01G13/00
Foreign References:
| JPS6377338U | 1988-05-23 | |||
| JPH11111907A | 1999-04-23 | |||
| JP2001047473A | 2001-02-20 | |||
| JPH02137219U | 1990-11-15 | |||
| JP2012054434A | 2012-03-15 | |||
| JP2003197485A | 2003-07-11 | |||
| JPH044734U | 1992-01-16 | |||
| JP2007036092A | 2007-02-08 |
Attorney, Agent or Firm:
OHIE Kunihisa et al. (JP)
Landlord Kunihisa (JP)
Landlord Kunihisa (JP)
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