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Patent Searching and Data


Title:
SLAG-MONITORING DEVICE, REMAINING LIFE ASSESSMENT DEVICE, SLAG-MONITORING METHOD, AND REMAINING LIFE ASSESSMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/070772
Kind Code:
A1
Abstract:
A slag-monitoring device for monitoring the state of slag adhering to a furnace wall, the device comprising: a fin temperature data-acquiring unit that acquires time-series temperature data of a fin as measured by a fin temperature measurement device that is provided outside the furnace wall and that is for measuring the temperature of the fin; a fin temperature fluctuation range information-acquiring unit that acquires fin temperature fluctuation range information related to the fluctuation range of the temperature of the fin from the time-series temperature data of the fin; and a heat-resistant body thickness estimation unit that estimates, on the basis of first association information in which the thickness of a heat-resistant body that is attached to an inner surface of the furnace wall and and that is formed of a frame-retardant material and/or slag is associated with the fin temperature fluctuation range information, the thickness of the heat-resistant body corresponding to the fin temperature fluctuation range information.

Inventors:
YOSHIDA SHIGERU (JP)
KAMIBAYASHI MASAKAZU (JP)
TAKAHASHI YUTA (JP)
Application Number:
PCT/JP2023/033734
Publication Date:
April 04, 2024
Filing Date:
September 15, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
MITSUBISHI POWER LTD (JP)
International Classes:
F23G5/50; C10J3/46; C10J3/48; F27D21/00; G01K1/14; G01K11/3206
Foreign References:
JPS5855707A1983-04-02
JPH07310080A1995-11-28
JPH10259387A1998-09-29
JP2003294219A2003-10-15
JP2011058933A2011-03-24
Attorney, Agent or Firm:
SSIP PATENT ATTORNEY CORPORATION (JP)
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