Title:
MULTIFUNCTIONAL VINYL COMPOUND, COMPOSITION THEREOF, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/070773
Kind Code:
A1
Abstract:
The present invention provides a vinyl compound that has excellent solvent solubility, that yields a cured product having excellent heat resistance, thermal decomposition stability, thermal conductivity, low dielectric constant, low dielectric tangent, and flame retardance, and that is useful for sealing electrical and electronic components and as a circuit board material. Provided is a multifunctional vinyl compound represented by general formula (1). In formula (1), R1-R4 each independently represent a hydrogen atom or a monovalent C1-6 hydrocarbon group.
Inventors:
OMURA MASAKI (JP)
OGAMI KOICHIRO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
OGAMI KOICHIRO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
Application Number:
PCT/JP2023/033749
Publication Date:
April 04, 2024
Filing Date:
September 15, 2023
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08F12/34; C07C43/215
Domestic Patent References:
| WO2020059625A1 | 2020-03-26 |
Foreign References:
| JP2014062243A | 2014-04-10 | |||
| JPH1171332A | 1999-03-16 | |||
| JP2023068626A | 2023-05-17 |
Other References:
ITSUNO, SHINICHI ET AL.: "Design and synthesis of chiral hyperbranched polymers containing cinchona squaramide moieties and their catalytic activity in the asymmetric Michael addition reaction", JOURNAL OF CATALYSIS., vol. 377, 2019, pages 543 - 549, XP085834023, Retrieved from the Internet DOI: 10.1016/j.jcat.2019.07.060
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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