Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/203458
Kind Code:
A1
Abstract:
A semiconductor package according to one embodiment comprises a first substrate layer and a second substrate layer arranged on the first substrate layer, wherein the first substrate layer includes: at least one first insulating layer; a first circuit pattern arranged on the first insulating layer; and a first via which passes through the first insulating layer and which is connected to the first circuit pattern, the second substrate layer includes: at least two second insulating layers arranged on the first insulating layer; a second circuit pattern arranged on the second insulating layer; and a second via which passes through the second insulating layer and which is connected to the second circuit pattern, the first insulating layer and the second insulating layer include different insulating materials, and the second via has a width differing from that of the first via.
Inventors:
KANG TAE GYU (KR)
LEE DONG KEON (KR)
JUNG WON SUK (KR)
LEE DONG KEON (KR)
JUNG WON SUK (KR)
Application Number:
PCT/KR2022/004238
Publication Date:
September 29, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L23/498; H01L23/00; H01L23/538
Foreign References:
| US20190380210A1 | 2019-12-12 | |||
| US10881004B1 | 2020-12-29 | |||
| KR20210030733A | 2021-03-18 | |||
| KR20170079388A | 2017-07-10 | |||
| KR20210031304A | 2021-03-19 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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