Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084899
Kind Code:
A1
Abstract:
This semiconductor device is provided with a first die pad, a first semiconductor element, a sealing resin, and a reinforcement material. The first semiconductor element is bonded to the first die pad. The sealing resin covers the first semiconductor element. The reinforcement material is bonded to the first die pad. The linear expansion coefficient of the reinforcement material is lower than the linear expansion coefficient of the sealing resin. In one example, the reinforcement material is covered by the sealing resin. In addition, the reinforcement material is on the same side as the first semiconductor element with respect to the first die pad in a first direction.
More Like This:
| JPS60254639 | ELECTRODE FILM AND MANUFACTURE THEREOF |
| JPS60169152 | WIRE CONNECTING METHOD |
Inventors:
HAYASHIGUCHI MASASHI (JP)
Application Number:
PCT/JP2023/034653
Publication Date:
April 25, 2024
Filing Date:
September 25, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48; H01L23/50; H01L25/07; H01L25/18
Foreign References:
| JP2008172115A | 2008-07-24 | |||
| JP2012209343A | 2012-10-25 | |||
| JPH06295970A | 1994-10-21 | |||
| JP2006190850A | 2006-07-20 | |||
| JP2018093093A | 2018-06-14 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
Download PDF: