Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/018827
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with: a supporting body which has a main surface that faces one side in the thickness direction and a back surface that faces a direction that is opposite to the direction to which the main surface faces; at least one semiconductor element which is arranged on the main surface; a conductive part which is formed on the main surface, while being formed of a conductive material; a thermistor which is arranged on the conductive part; and a sealing resin which covers at least a part of the supporting body, the semiconductor element, the thermistor and the conductive part. The supporting body comprises an insulating substrate that has the main surface; the thermistor is bonded to the conductive part by the intermediary of a conductive bonding material; and the back surface is exposed from the sealing resin.
Inventors:
MATSUO MASAAKI (JP)
TSUKAMOTO YOSHIHISA (JP)
TSUKAMOTO YOSHIHISA (JP)
Application Number:
PCT/JP2023/023347
Publication Date:
January 25, 2024
Filing Date:
June 23, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/29; H01L25/07; H01L25/18
Foreign References:
| JP2018082069A | 2018-05-24 | |||
| JP2013201325A | 2013-10-03 | |||
| JP2007013019A | 2007-01-18 | |||
| JPH11154720A | 1999-06-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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