Title:
SEAL STRUCTURE OF ELECTRONIC DEVICE, ELECTRONIC DEVICE PROVIDED WITH SEAL STRUCTURE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/159065
Kind Code:
A1
Abstract:
This seal structure of an electronic device (1) is provided with a housing (10) in which a base (11) and a case (12) are sealed by a sealing material (60) and a closed space (13) is provided enclosed by the base (11) and the case (12), and with at least one terminal (20) having a main body (21) and a leg (22), wherein the base (11) comprises a terminal groove (112) that houses the main body (21), a through-hole (113) that houses the leg (22), and an arrangement region forming area (2, 114, 116) which, together with the main body (21), the leg (22), the terminal groove (112) and the through-hole (113), forms an arrangement region for the sealing material (60) that extends from outside of the housing (10) and passes between the through-hole (113) and the leg (22) and between the terminal groove (112) and the main body (21) towards the closed space (13).
Inventors:
KITAGAWA TATSURO (JP)
FUKUI NORIO (JP)
KIDO RYOICHI (JP)
KAWAGUCHI NAOKI (JP)
FUKUI NORIO (JP)
KIDO RYOICHI (JP)
KAWAGUCHI NAOKI (JP)
Application Number:
PCT/JP2017/044715
Publication Date:
September 07, 2018
Filing Date:
December 13, 2017
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H9/04; H01H9/02; H01H50/02
Foreign References:
| JPS636647U | 1988-01-18 | |||
| JPH087735A | 1996-01-12 | |||
| JPH02143751U | 1990-12-06 | |||
| JPH0440444U | 1992-04-06 | |||
| JP2012043642A | 2012-03-01 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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