Title:
RESIN MOLDED BODY AND METHOD FOR PRODUCING RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/062763
Kind Code:
A1
Abstract:
This resin molded body comprises a translucent resin layer and a bright material included in the resin layer. The bright material includes a metal layer formed from a metal material, a colored layer that contains a coloring agent and covers the metal layer, and an exposed section in which the metal layer is exposed from the colored layer.
Inventors:
KONDO MITSUHIRO (JP)
Application Number:
PCT/JP2023/027566
Publication Date:
March 28, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
INOUE MTP KK (JP)
International Classes:
C08L101/00; B29C45/00; B32B15/08; C08K3/08
Domestic Patent References:
| WO2005078022A1 | 2005-08-25 | |||
| WO2015005434A1 | 2015-01-15 |
Foreign References:
| JP2004189786A | 2004-07-08 | |||
| JP2007054998A | 2007-03-08 | |||
| JP2011184620A | 2011-09-22 | |||
| JPH11963A | 1999-01-06 | |||
| JP2000246829A | 2000-09-12 | |||
| JP2014168916A | 2014-09-18 | |||
| JP2004083608A | 2004-03-18 |
Attorney, Agent or Firm:
KT&S IP FIRM, P.C. (JP)
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