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Title:
RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ENCAPSULATION, SHAPED RESIN OBJECT FOR OPTICAL-SEMICONDUCTOR ENCAPSULATION, OPTICAL-SEMICONDUCTOR ENCAPSULATION MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/176820
Kind Code:
A1
Abstract:
Provided are: a resin composition for optical-semiconductor encapsulation which has a black color for heightening the contrast of a display and has adequate light-transmitting properties; and a shaped resin object for optical-semiconductor encapsulation, an optical-semiconductor encapsulation material, and an optical semiconductor device each obtained using the resin composition for optical-semiconductor encapsulation. The resin composition for optical-semiconductor encapsulation comprises an epoxy resin, a hardener, carbon black, and an inorganic filler. A cured object (solid cylinder with dimensions of 50 mm (diameter) × 0.3 mm (thickness)) obtained from the resin composition has a total light transmittance at 450-nm wavelength of 3-60% and an in-line transmittance at 450-nm wavelength of 0.01-60%, excluding 60%, the ratio of (the total light transmittance)/(the in-line transmittance) being 1-300, excluding 1. A cured object (solid cylinder with dimensions of 50 mm (diameter) × 1 mm (thickness)) obtained therefrom gives reflected light which, in the L*a*b* color space, has an absolute value of a* of 3 or less and an absolute value of b* of 3 or less.

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Inventors:
HIMENO NAOKO (JP)
OTA SHINYA (JP)
YAMANE MINORU (JP)
HOTEHAMA HIROYUKI (JP)
Application Number:
PCT/JP2023/009820
Publication Date:
September 21, 2023
Filing Date:
March 14, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08L63/00; C08G59/18; C08K3/013; C08K3/04; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
WO2019012608A12019-01-17
Foreign References:
JP2007238781A2007-09-20
JP2021528503A2021-10-21
JP2018009090A2018-01-18
JP2006265370A2006-10-05
JP2003213088A2003-07-30
JP2010276855A2010-12-09
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF:
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