Title:
RESIN COMPOSITION AND FORMED ARTICLE
Document Type and Number:
Japanese Patent JP2011178858
Kind Code:
A
Abstract:
To provide a resin composition capable of providing a formed article capable of heightening surface smoothness when laminated on a member having holes or unevenness on the surface, and to provide the formed article.
The resin composition contains an epoxy resin, a cyanate compound, a first silica having an average particle diameter of ≥0.1 μm and ≤10 μm, and a second silica having an average particle diameter of ≥1 nm and <100 nm. The formed article is obtained by forming the resin composition into a sheet shape.
Inventors:
HAYASHI TATSUJI
UENISHI SHOTA
DEGUCHI HIDEHIRO
YOKOTA REONA
TOTTORI DAISUKE
UENISHI SHOTA
DEGUCHI HIDEHIRO
YOKOTA REONA
TOTTORI DAISUKE
Application Number:
JP2010043243A
Publication Date:
September 15, 2011
Filing Date:
February 26, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L63/00; C08G59/40; C08K3/36; C08K5/315
Domestic Patent References:
| JP2008069291A | 2008-03-27 | |||
| JP2009013205A | 2009-01-22 | |||
| JP2009132819A | 2009-06-18 | |||
| JP2009191198A | 2009-08-27 | |||
| JPH09118829A | 1997-05-06 | |||
| JP2011026419A | 2011-02-10 | |||
| JP2006036915A | 2006-02-09 | |||
| JP2008133456A | 2008-06-12 |
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto
Table of contents Makoto
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