Title:
RESIN COMPOSITION, MOLDED BODY, AND FILM
Document Type and Number:
WIPO Patent Application WO/2022/210029
Kind Code:
A1
Abstract:
This resin composition includes a rubber-containing polymer with an average particle size of 200 nm or more, a thermoplastic resin with a mass average molecular weight of 100,000 or less, and a plasticizer. The proportion of the plasticizer relative to a total amount of 100 parts by mass of the rubber-containing polymer and the thermoplastic resin is 1-20 parts by mass.
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Inventors:
ABE JUNICHI (JP)
Application Number:
PCT/JP2022/012606
Publication Date:
October 06, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L101/00; C08J5/18; C08L51/04; C08L71/02
Domestic Patent References:
WO2014167868A1 | 2014-10-16 | |||
WO2011074605A1 | 2011-06-23 | |||
WO2019021683A1 | 2019-01-31 | |||
WO2011074605A1 | 2011-06-23 |
Foreign References:
JP2001354819A | 2001-12-25 | |||
JP2006299037A | 2006-11-02 | |||
JP2004018746A | 2004-01-22 | |||
JP2008239739A | 2008-10-09 | |||
JP2006143785A | 2006-06-08 | |||
JP2004352841A | 2004-12-16 | |||
JP2002275341A | 2002-09-25 | |||
JP2014061705A | 2014-04-10 | |||
JPH1180487A | 1999-03-26 | |||
JP2003342389A | 2003-12-03 | |||
JP2021054555A | 2021-04-08 | |||
JP2017196814A | 2017-11-02 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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