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Patent Searching and Data


Title:
RESIN COMPOSITION, MOLDED BODY, AND FILM
Document Type and Number:
WIPO Patent Application WO/2022/210029
Kind Code:
A1
Abstract:
This resin composition includes a rubber-containing polymer with an average particle size of 200 nm or more, a thermoplastic resin with a mass average molecular weight of 100,000 or less, and a plasticizer. The proportion of the plasticizer relative to a total amount of 100 parts by mass of the rubber-containing polymer and the thermoplastic resin is 1-20 parts by mass.

Inventors:
ABE JUNICHI (JP)
Application Number:
PCT/JP2022/012606
Publication Date:
October 06, 2022
Filing Date:
March 18, 2022
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L101/00; C08J5/18; C08L51/04; C08L71/02
Domestic Patent References:
WO2014167868A12014-10-16
WO2011074605A12011-06-23
WO2019021683A12019-01-31
WO2011074605A12011-06-23
Foreign References:
JP2001354819A2001-12-25
JP2006299037A2006-11-02
JP2004018746A2004-01-22
JP2008239739A2008-10-09
JP2006143785A2006-06-08
JP2004352841A2004-12-16
JP2002275341A2002-09-25
JP2014061705A2014-04-10
JPH1180487A1999-03-26
JP2003342389A2003-12-03
JP2021054555A2021-04-08
JP2017196814A2017-11-02
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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