Title:
RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/157828
Kind Code:
A1
Abstract:
A resin composition comprising (a) a high-molecular-weight component having a weight average molecular weight of 10000 or more, (b) a heat-curable resin having a weight average molecular weight of less than 10000, (c) a curing agent and (d) a filler, wherein the filler (d) comprises strontium titanate.
Inventors:
HONDA KAZUTAKA (JP)
UENO KEIKO (JP)
MATSUBARA NOZOMI (JP)
UENO KEIKO (JP)
MATSUBARA NOZOMI (JP)
Application Number:
PCT/JP2019/002959
Publication Date:
August 06, 2020
Filing Date:
January 29, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08F290/06; C08K3/22; C08K5/14; C09J7/30; C09J11/04; C09J11/06; C09J133/00; C09J179/04; C09J201/00; H01L21/60
Domestic Patent References:
| WO2016175325A1 | 2016-11-03 |
Foreign References:
| CN106366477A | 2017-02-01 | |||
| US20180263115A1 | 2018-09-13 | |||
| JPH1060138A | 1998-03-03 | |||
| JP2008094993A | 2008-04-24 | |||
| JP2018065908A | 2018-04-26 | |||
| JP2017082201A | 2017-05-18 | |||
| JPH0940933A | 1997-02-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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