Title:
RELEASE FILM AND METHOD FOR MANUFACTURING MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/071185
Kind Code:
A1
Abstract:
A release film 10 according to a first invention includes a first release layer 1 comprising a first thermoplastic resin composition, and a cushion layer 3 laminated on the first release layer 1. The thermal diffusivity coefficient in the thickness direction of the release film 10 is 1.3×10-7m2/s or more. A release film 10 according to a second invention has a first release layer 1 comprising a first thermoplastic resin composition, and a cushion layer 3 laminated on the first release layer 1. The puncture strength of the release film 10 is 0.5 N or more, as measured when punctured by a needle from the first release layer side under conditions of 175°C in accordance with JIS Z 1707.
Inventors:
KONOIKE SHOGO (JP)
Application Number:
PCT/JP2023/035122
Publication Date:
April 04, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B29C43/34; B32B27/36; H05K1/03
Domestic Patent References:
| WO2019131163A1 | 2019-07-04 |
Foreign References:
| JP2016068371A | 2016-05-09 | |||
| JP2016002730A | 2016-01-12 | |||
| JP2016112729A | 2016-06-23 | |||
| JP2016168688A | 2016-09-23 | |||
| JP2016124270A | 2016-07-11 |
Attorney, Agent or Firm:
FUJITANI, Yasuyuki et al. (JP)
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