Title:
RECEPTION SUBSTRATE, METHOD FOR MANUFACTURING RECEPTION SUBSTRATE, LIFTING METHOD, HOLDING METHOD, AND METHOD FOR CLEANING MICROSTRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/085025
Kind Code:
A1
Abstract:
The present invention provides a reception substrate for transferring and receiving, through laser lift-off, a microstructure formed on a supply substrate. The reception substrate has a curable resin layer on the surface to which the microstructure is to be transferred. Accordingly, the reception substrate can receive the microstructure while minimizing damages, and hold the microstructure while suppressing misalignment and tilting.
Inventors:
TOYOSHIMA TAKEHARU (JP)
OGAWA YOSHINORI (JP)
KONDO KAZUNORI (JP)
OZAI TOSHIYUKI (JP)
OGAWA YOSHINORI (JP)
KONDO KAZUNORI (JP)
OZAI TOSHIYUKI (JP)
Application Number:
PCT/JP2023/036795
Publication Date:
April 25, 2024
Filing Date:
October 10, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L21/50; H01L33/48
Domestic Patent References:
| WO2021039128A1 | 2021-03-04 |
Foreign References:
| JP2013077611A | 2013-04-25 | |||
| JP2002185039A | 2002-06-28 | |||
| US20190181122A1 | 2019-06-13 | |||
| JP2014130918A | 2014-07-10 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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