Title:
LIFTING METHOD AND RECEIVING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/085024
Kind Code:
A1
Abstract:
The present invention is a lifting method for moving a fine structure that is formed on a supply substrate to a receiving substrate through laser lift-off, wherein a surface of the fine structure that faces the receiving substrate has a recess that is greater in height in an outer-side region of the surface than in an inner-side region, a surface of the receiving substrate to which the fine structure is moved has a resin layer, and laser lift-off is performed in a state in which the resin layer is in contact with or close to the bottom surface of the recess in the fine structure. This makes it possible to provide a lifting method with which it is possible to move the fine structure having the recess to the receiving substrate through laser lift-off without breaking the fine structure.
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Inventors:
TOYOSHIMA TAKEHARU (JP)
OGAWA YOSHINORI (JP)
KONDO KAZUNORI (JP)
OZAI TOSHIYUKI (JP)
OGAWA YOSHINORI (JP)
KONDO KAZUNORI (JP)
OZAI TOSHIYUKI (JP)
Application Number:
PCT/JP2023/036788
Publication Date:
April 25, 2024
Filing Date:
October 10, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L21/50; H01L21/60; H01L33/48
Foreign References:
| JP2017157724A | 2017-09-07 | |||
| US20190181122A1 | 2019-06-13 | |||
| JP2013211443A | 2013-10-10 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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