Title:
QUANTUM DEVICE AND METHOD FOR MANUFACTURING QUANTUM DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188391
Kind Code:
A1
Abstract:
This quantum device (1) includes a first substrate (10) and a plurality of second substrates (20A-20D) mounted on the first substrate, wherein: the first substrate has a first base material (11) including a first surface, a plurality of first pads (14) provided on the first surface, and wiring (15) connecting two first pads among the plurality of first pads; each of the plurality of second substrates has a second base material (21) including a second surface facing the first surface, second pads (33) provided on the second surface and facing the first pads, and quantum bits (23) connected to the second pads; the quantum bits included in one second substrate among the plurality of second substrates, and the quantum bits included in another second substrate among the plurality of second substrates are capacitively coupled together via the wiring; and the quantum device has an alignment mechanism (13, 22) that constrains each of the plurality of second substrates within a predetermined area in a plane parallel to the first surface of the first substrate.
Inventors:
SHIMANOUCHI TAKEAKI (JP)
Application Number:
PCT/JP2022/016879
Publication Date:
October 05, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
H01L39/22; H01L39/02; H01L39/24
Foreign References:
| JP2020511794A | 2020-04-16 | |||
| US20180013052A1 | 2018-01-11 | |||
| JP2021504956A | 2021-02-15 | |||
| US20200343434A1 | 2020-10-29 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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