PROCESSING FLUID SUPPLY APPARATUS AND PROCESSING FLUID SUPPLY METHOD

WIPO Patent Application WO/2024/085014

A1

A processing fluid supply apparatus (70) according to one aspect of the present disclosure is provided with a supply line (61), a cooling unit, a pump (75), a return line (90), a heating unit, and a flow volume adjustment mechanism. The supply line (61) supplies a processing fluid from a processing fluid supply source (60) to a substrate processing apparatus (1), the processing fluid supply source (60) supplying the processing fluid in gaseous state. The cooling unit is provided in the supply line (61), and generates a processing fluid in liquid state by cooling the processing fluid in gaseous state. The pump (75) is provided downstream of the cooling unit in the supply line (61). The return line (90), which is branched from a branch portion (76) positioned downstream of the pump (75) in the supply line (61), returns the processing fluid to a converging portion (71) positioned upstream of the cooling unit in the supply line (61). The heating unit is provided in the return line (90) to heat the processing fluid. The flow volume adjustment mechanism adjusts the flow volume of the processing fluid supplied to the heating unit.

JP6974133	How to mold a SiC ingot
JPS62291925	CENTRIFUGAL DRYING DEVICE FOR SEMICONDUCTOR WAFER
WO/2022/104622	METHOD FOR PROCESSING SEMICONDUCTOR WAFERS

NAKASHIMA MIKIO (JP)
UMEZAKI SHOTA (JP)
HAYASHIDA TAKAHIRO (JP)

PCT/JP2023/036677

April 25, 2024

October 10, 2023

Click for automatic bibliography generation  

TOKYO ELECTRON LTD (JP)

H01L21/304

WO2019031303A1

2019-02-14

JP7109328B2

2022-07-29

SAKAI INTERNATIONAL PATENT OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: SYSTEM, PROGRAM, AND METHOD

Next Patent: NOTIFICATION SYSTEM AND NOTIFICATION METHOD