PURPOSE: To alleviate the adherence of mist and dust to a wafer by feeding ultrapure water from a nozzle provided on the top of the inner wall of a semiconductor wafer centrifugal drying device to the whole surface of the inner wall.

CONSTITUTION: Ultrapure water 7 is fed from the port 2 of a nozzle 1 to the whole surface of an inner wall 5, and water 13 scattered from a wafer 4 is collided with the wall 5 by mean of centrifugal force based on the rotation of a carrier 30. In this case, mist 14 is scattered toward the bottom 6 of the device according to a composite vector 12 of a vector component 11 of the water 7 and a vector component 10 of the wafer direction of the mist reflected on the wall 5, and exhausted together with the water 7 from a hole 3. A cover 20 is placed on the device. Since moisture in the device is raised, a static electricity on the wafer 4 generated by a friction with air is alleviated. According to the structure, dusts 8 in the device is cumulatively exhausted through the hole 3 together with the water to alleviate the adherence of mist and dust for causing the wafer to be contaminated.