Title:
POLYOLEFIN-BASED ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/075367
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesive composition which has high adhesion between a metal substrate and a non-polar resin substrate such as one made of a liquid crystal polymer, also has solder heat resistance and low dielectric properties, and moreover has an exceptional dielectric tangent after water-absorption saturation. This adhesive composition contains an acid-modified polyolefin (a) and an epoxy resin (b), and satisfies conditions (1) and (2). (1) The relative dielectric constant (εc1) at 1 GHz immediately after curing of a cured product of the adhesive composition is 3.0 or less, and the dielectric tangent (tanδ1) is 0.02 or less. (2) The amount of change between the dielectric tangent (tanδ1) at 1 GHz immediately after curing of a cured product of the adhesive composition and the dielectric tangent (tanδ2) at 1 GHz after the cured product has been immersed in 25°C water for 24 hours is 0.01 or less.
Inventors:
SONODA RYO (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2020/038267
Publication Date:
April 22, 2021
Filing Date:
October 09, 2020
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/32; C09J7/30; C09J11/06; C09J11/08; C09J123/26; C09J163/00; H05K1/03
Domestic Patent References:
| WO2016047289A1 | 2016-03-31 | |||
| WO2016031342A1 | 2016-03-03 |
Foreign References:
| JP2019127501A | 2019-08-01 |
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