POLYAMIDE RESIN COMPOSITION FOR SINGLE-LAYER HOLLOW MOLDED BODY

WIPO Patent Application WO/2023/218686

A1

Provided is a polyamide resin composition for a single-layer hollow molded body having polyamide 6 as the main component, substantially without using polyamide 11 and polyamide 12, wherein the properties are equivalent to those of a multilayered hollow molded body, the extrusion moldability of the hollow molded body is excellent, and the flexibility, impact resistance, and durability of the obtained molded body are excellent.　The polyamide resin composition is a polyamide resin composition for extrusion molding to produce a single-layer hollow molded body, which contains polyamide 6 (a), a polyolefin (b) having a functional group, and a plasticizer (c); the relative viscosity of the polyamide 6 (a), measured at 25°C when 1 g of the polyamide 6 (a) is dissolved in 100 mL of 96% sulfuric acid in accordance with JIS K6920, is 3.0-4.5; 100 mass% of polyamide resin composition contains 60-90 mass% of the polyamide 6 (a), 3-25 mass% of the polyolefin (b) having a functional group, and 3-20 mass% of the plasticizer (c); and the polyolefin (b) having a functional group is a copolymer of ethylene and a C4 or higher α-olefin having a group derived from at least one selected from the group consisting of maleic anhydride and itaconic anhydride.

NOZAKI NATSUMI (JP)
SASAKI RYOUSUKE (JP)
KUSUMOTO TAKAAKI (JP)
HERRERO PONS ROSER (ES)
GONZALEZ SANUDO ALMUDENA (ES)

PCT/JP2022/042505

November 16, 2023

November 16, 2022

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UBE CORP (JP)

C08L77/00; C08K5/10; C08K5/435; C08L23/00; C08L23/26; C08L101/00; F16L11/04

JP2001172498A	2001-06-26
JP2013500356A	2013-01-07
JP2010111730A	2010-05-20
JP2020059846A	2020-04-16
JP2018197561A	2018-12-13
JPH01101365A	1989-04-19

TSUKUNI & ASSOCIATES et al. (JP)

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