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Title:
PHOTOSENSITIVE COMPOSITION, CURED FILM, LIGHT-BLOCKING FILM, COLOR FILTER, OPTICAL ELEMENT, SOLID IMAGING ELEMENT, HEADLIGHT UNIT
Document Type and Number:
WIPO Patent Application WO/2024/024494
Kind Code:
A1
Abstract:
The present invention provides a photosensitive composition that suppresses development residue and makes it possible to form a cured film that has excellent substrate adhesion. This photosensitive composition includes a resin, a colorant, a photopolymerization initiator, and a polymerizable compound. The resin includes: a first resin that contains substantially no fluorine atoms and includes a repeating unit that has a polyoxyalkylene chain represented by formula (1); and a second resin that does not include a repeating unit that has a polyoxyalkylene chain represented by formula (1). The first resin is 1–50 mass% of the total mass of the resin. Formula (1): -(R1-O)n-.

Inventors:
IDEI HIROAKI (JP)
ADACHI MISAHO (JP)
YOKOYAMA NORIFUMI (JP)
SATO NORIAKI (JP)
Application Number:
PCT/JP2023/025569
Publication Date:
February 01, 2024
Filing Date:
July 11, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/033; C08F2/44; C08F20/20; C08F265/06; C08F283/00; C08F287/00; C08F290/12; C08L33/04; C08L101/06; F21S41/141; F21S41/155; F21S41/40; G02B5/20; G03F7/004; G03F7/032; G03F7/038; H01L27/146; F21W102/135; F21Y115/10; F21Y115/15
Domestic Patent References:
WO2022039224A12022-02-24
Foreign References:
JP2009282115A2009-12-03
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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