Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR MANUFACTURING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3797330
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent resolution, adhesion properties and imaging properties, a photosensitive element, a method for manufacturing resist patterns, and a method for manufacturing a printed wiring board.
SOLUTION: The photosensitive resin composition containing a carboxyl group-containing binder polymer containing styrene or styrene derivatives as a copolymerization component (A), a photopolymerizable unsaturated compound (B), a photopolymerization initiator (C), and a general formula (1)(D), in which the photopolymerizable unsaturated compound (B) contains the compound expressed by a general formula (2) as an essential component, the photosensitive element laminated by applying such photosensitive resin composition on a support and drying the coating, and the method for manufacturing the resist patterns comprising laminating such photosensitive element on a substrate for circuit formation, irradiating the element with active rays in the shape of an image, and removing unexposed sections by development are provided.


Inventors:
Takeshi Ohashi
Tachiya Ichikawa
Application Number:
JP2003011487A
Publication Date:
July 19, 2006
Filing Date:
January 20, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G03F7/004; C08F2/44; C08F290/06; C08L25/00; G03F7/027; G03F7/033; H05K3/06; H05K3/18; (IPC1-7): G03F7/004; C08F2/44; C08F290/06; G03F7/027; H05K3/06; H05K3/18
Domestic Patent References:
JP7281437A
JP8320561A
JP4095960A
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu