Title:
PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/082536
Kind Code:
A1
Abstract:
Disclosed is a packaging structure. The packaging structure comprises a substrate and multiple crystal grains. The multiple crystal grains are stacked on the substrate, projections of two adjacent crystal grains on the substrate partially coincide, and the projections of two crystal grains arranged at an interval on the substrate at least partially coincide. The two crystal grains arranged at an interval are electrically connected by means of an electric signal path, a first electric connection layer of the electric signal path is located between the two crystal grains arranged at an interval, and the first electric connection layer is electrically connected to the two crystal grains arranged at an interval.
Inventors:
PAN YING (CN)
Application Number:
PCT/CN2023/082474
Publication Date:
April 25, 2024
Filing Date:
March 20, 2023
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/538; H01L23/528; H01L25/065
Domestic Patent References:
| WO2021097730A1 | 2021-05-27 |
Foreign References:
| CN102779802A | 2012-11-14 | |||
| CN210668369U | 2020-06-02 | |||
| CN109755182A | 2019-05-14 |
Attorney, Agent or Firm:
BOXIN CHINA INTELLECTUAL PROPERTY (CN)
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