Title:
HEAT SINK, HEAT SINK MANUFACTURING METHOD, AND COMPUTER
Document Type and Number:
WIPO Patent Application WO/2024/082535
Kind Code:
A1
Abstract:
Embodiments of the present application relate to the field of computers, and provide a heat sink, a heat sink manufacturing method, and a computer. The heat sink comprises a heat dissipation structure body and a first cooling structure. The heat dissipation structure body is provided with a slotted hole structure. The slotted hole structure extends in the temperature diffusion direction. The opening of the slotted hole structure is formed in the end of the heat dissipation structure body away from a heat source. The first cooling structure is laid on the inner wall of the slotted hole structure. The first cooling structure is provided with cooling channels for adsorbing a liquid coolant. The configuration of the present application solves the problems of low heat dissipation efficiency and poor heat dissipation effect of the heat sink, and improves the heat dissipation efficiency.
Inventors:
CHEN GUANG (CN)
JIANG XINGFANG (CN)
LI WENFANG (CN)
SUN JINGLI (CN)
JIANG XINGFANG (CN)
LI WENFANG (CN)
SUN JINGLI (CN)
Application Number:
PCT/CN2023/082292
Publication Date:
April 25, 2024
Filing Date:
March 17, 2023
Export Citation:
Assignee:
SUZHOU METABRAIN INTELLIGENT TECH CO LTD (CN)
International Classes:
G06F1/20
Foreign References:
| CN115373498A | 2022-11-22 | |||
| DE202010000787U1 | 2010-10-28 | |||
| CN2561975Y | 2003-07-23 | |||
| CN215984134U | 2022-03-08 | |||
| US20070107880A1 | 2007-05-17 |
Attorney, Agent or Firm:
KANGXIN PARTNERS , P.C. (CN)
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