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Title:
NONWOVEN FABRIC CONTAINING POLYPHENYLENE ETHER FIBER AND REINFORCING FIBER, MOLDED BODY CONTAINING POLYPHENYLENE ETHER AND REINFORCING FIBER, AND METHODS FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/136139
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a nonwoven fabric containing a polyphenylene ether fiber and a reinforcing fiber, the nonwoven fabric being imparted with a high degree of flame resistance and heat resistance as well as low water absorbency, and being capable of expressing excellent characteristics such as heat resistance when formed into a molded body; and a method for manufacturing the nonwoven fabric. The purpose of the present invention is also to provide: a molded body containing a polyphenylene ether and a reinforcing fiber, the molded body having low water absorbency, being imparted with a high degree of heat resistance, and being imparted with various properties such as impact resistance and moisture absorption resistance in a well-balanced manner. Another purpose of the present invention is to provide a method for manufacturing a molded body with which it is possible to manufacture such a molded body in an efficient manner. The present invention pertains to: a nonwoven fabric containing a polyphenylene ether fiber and a reinforcing fiber, the nonwoven fabric being characterized in that the number of crimps of the polyphenylene ether fiber is 2 per 25 mm to 24 per 25 mm; and a method for manufacturing the same. The present invention also pertains to a molded body containing a polyphenylene ether and a reinforcing fiber, the molded body being characterized by having a water absorbency of 0.5 mass% or below; and a method for manufacturing the same.

Inventors:
YASUI AKIFUMI (JP)
HOJO KENTA (JP)
NISHIMITSU CHIKAKO (JP)
TANINAKA TERUYUKI (JP)
Application Number:
PCT/JP2022/048246
Publication Date:
July 20, 2023
Filing Date:
December 27, 2022
Export Citation:
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Assignee:
TOYOBO MC CORP (JP)
International Classes:
D04H1/4326; C08J5/04; D04H1/4382
Foreign References:
JP2021116488A2021-08-10
JPH1037054A1998-02-10
JP2008138294A2008-06-19
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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