To provide a laminated plate showing low thermal expansion ratio, excellent solder heat resistance and good machinability, and having a thin insulating layer, and also to provide its manufacturing method.

A prepreg having a nonwoven fabric of polybenzazole fiber is used as a base material for at least one layer other than the outermost layer of the laminated plate composed of three or more insulating layers. It is preferable that the polybenzazole fiber is preliminarily partly or wholly flattened. The nonwoven fabric of para-aramid fiber as the base material is preferably used for the outermost layer. The para-aramid fiber is preferably poly-p-phenylene diphenyl ether terephthalamide. In the representative embodiment of the laminated plate having a build-up layer overlying each of both surfaces of a core base plate, the prepreg having nonwoven fabric of polybenzazole fiber as the base material is used for the layer other than the outermost layer, and the prepreg having the nonwoven fabric of the para-aramid fiber as the base material is used for the outermost layer.