METHOD FOR PREDICTING VOID IN RESIN-MOLDED ARTICLE, METHOD FOR REDUCING VOID IN RESIN-MOLDED ARTICLE, AND RECORDING MEDIUM

Title:

METHOD FOR PREDICTING VOID IN RESIN-MOLDED ARTICLE, METHOD FOR REDUCING VOID IN RESIN-MOLDED ARTICLE, AND RECORDING MEDIUM

Document Type and Number:

WIPO Patent Application WO/2024/063084

Kind Code:

A1

Abstract:

Provided is a method for predicting the generation behavior of a void generated inside an injection-molded article obtained by injection-molding a thermoplastic resin into a mold, the method comprising: a step for creating an analysis model in which the injection-molded article is divided into a plurality of elements; a step for calculating a temperature distribution and a pressure distribution of the analysis model in a thermoplastic resin molding step; a step for changing the temperature distribution or the pressure distribution; a step for calculating, from the temperature distribution and the pressure distribution after the change, an elastic modulus distribution and a temperature load distribution of the analysis model using temperature dependency data of the elastic modulus, data of the thermal expansion coefficient, and PVT data of the thermoplastic resin that have been measured in advance; a step for calculating distortion caused in the respective elements of the analysis model by a structural analysis using the elastic modulus distribution and the temperature load distribution; and a step for predicting the location of the occurrence of a void and/or the quantity of a void from the distortion.

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Inventors:

HAMANO YUHSUKE (JP)
AOKI GEN (JP)
MIYAZAKI AKIHIRO (JP)
AMANO YUTA (JP)

Application Number:

PCT/JP2023/034055

Publication Date:

March 28, 2024

Filing Date:

September 20, 2023

Export Citation:

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Assignee:

POLYPLASTICS CO (JP)

International Classes:

B29C45/76

Foreign References:

JP2009233882A	2009-10-15
JPH08197600A	1996-08-06
JP2000211005A	2000-08-02

Attorney, Agent or Firm:

SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)

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