Title:
METHOD FOR MULTI-BEAM LASER POLISHING OF A DIAMOND SURFACE
Document Type and Number:
WIPO Patent Application WO/2023/091054
Kind Code:
A1
Abstract:
The invention relates to laser polishing polycrystalline diamond wafers, and can be used for reducing the roughness of the diamond surfaces of wafers. A method for laser polishing a diamond surface is based on focusing a laser beam on a diamond surface at an angle of 80-90° from a vertical extending downward to the surface undergoing treatment, and scanning the diamond surface with the laser beam. A device for laser polishing a diamond surface comprises a laser radiation source optically coupled to the diamond surface of a wafer mounted in a micropositioner, a laser beam splitting assembly, and optical assemblies for steering the split laser beams, which are optically coupled to the laser beam splitting assembly, wherein the assemblies for steering the split laser beams are optically coupled to the diamond surface and are mounted so that the diamond surface can be irradiated from different directions simultaneously.
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Inventors:
KONONENKO TARAS VIKTOROVICH (RU)
PASHININ VLADIMIR PAVLOVICH (RU)
KOMLENOK MAKSIM SERGEEVICH (RU)
KONOV VITALII IVANOVICH (RU)
PASHININ VLADIMIR PAVLOVICH (RU)
KOMLENOK MAKSIM SERGEEVICH (RU)
KONOV VITALII IVANOVICH (RU)
Application Number:
PCT/RU2022/050358
Publication Date:
May 25, 2023
Filing Date:
November 14, 2022
Export Citation:
Assignee:
OBSHHESTVO S OGRANICHENNOI OTVETSTVENNOSTYU «VANDER TEXNOLODZHIS» (RU)
International Classes:
B23K26/361; B23K26/067; B23K26/08; B24B9/16; B28D5/00
Foreign References:
| KR20130069011A | 2013-06-26 | |||
| CN105772947A | 2016-07-20 | |||
| JP3096943B2 | 2000-10-10 |
Attorney, Agent or Firm:
BUTENKO, Ludmila Vasilevna (RU)
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