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Title:
METHOD FOR DECOMPOSING HALOGEN-CONTAINING ORGANIC SUBSTANCES, AND SYSTEM FOR DECOMPOSING HALOGEN-CONTAINING SUBSTANCES
Document Type and Number:
WIPO Patent Application WO/2023/032494
Kind Code:
A1
Abstract:
Provided are a method for decomposing halogen-containing organic substances and a system for decomposing halogen-containing substances, in which a heat treatment temperature for decomposing halogen-containing organic substances can be lower than before. This method for decomposing halogen-containing organic substances includes: a contact step (S1) for bringing halogen-containing organic substances to be treated into contact with a first compound and a second compound; and a heating step (S2) for decomposing the substances to be treated that have been brought into contact with the first compound and the second compound by heating the substances in an oxygen-containing atmosphere. The first compound contains an oxide semiconductor. The second compound contains an element that generates a halide upon reacting with a halogen contained in the substances to be treated.

Inventors:
OHASHI TOSHIMASA (JP)
ITO TSUYOSHI (JP)
KANI YUUKO (JP)
Application Number:
PCT/JP2022/028088
Publication Date:
March 09, 2023
Filing Date:
July 19, 2022
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
C08J11/16; B01J21/06; B01J23/745; B01J27/232; B09B3/40
Domestic Patent References:
WO2013089222A12013-06-20
Foreign References:
JP2009270123A2009-11-19
JP2020028850A2020-02-27
JP2015048427A2015-03-16
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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