Title:
MEASUREMENT DEVICE FOR PACKAGE STRESS OF CHIP, AND MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/082185
Kind Code:
A1
Abstract:
A measurement device for the package stress of a chip, and a measurement method. The measurement device for the package stress of a chip comprises a test table (1), a first XYZ-axis movement device (2) mounted on the test table (1), an X-ray measurement device (21) assembled on the first XYZ-axis movement device (2), an upper computer (3), a second XYZ-axis movement device (5) mounted on the test table (1), a distance measurement device (92), and an etching spray head (91). The upper computer (3) controls the X-ray measurement device (21) to measure the stress on the surface of a chip to be subjected to measurement (72); then said chip is transmitted, by means of a transmission component (4), to the etching spray head (91) where said chip (72) is etched; then, an internal stress of said chip is measured by means of the X-ray measurement device (21); and an etching process and a stress measurement process are performed cyclically until stress measurement of all depth gradients is completed. By using the measurement device and the measurement method, the measurement result can be more accurate, the operation time can be reduced, the measurement efficiency can be improved, and the device and method do not increase the difficulty of chip design, and also do not cause the chip itself to be complex.
Inventors:
YU ZILIANG (CN)
YU BOXUAN (CN)
LIU YU (CN)
YU BOXUAN (CN)
LIU YU (CN)
Application Number:
PCT/CN2022/126265
Publication Date:
April 25, 2024
Filing Date:
October 19, 2022
Export Citation:
Assignee:
CRRC ACAD CO LTD (CN)
International Classes:
H01L21/66; G01L1/25; G01N23/00
Foreign References:
| CN110146204A | 2019-08-20 | |||
| CN108375595A | 2018-08-07 | |||
| CN211348010U | 2020-08-25 | |||
| JP2003315171A | 2003-11-06 | |||
| JP2015072171A | 2015-04-16 | |||
| CN114167255A | 2022-03-11 | |||
| JP2019132599A | 2019-08-08 | |||
| JPH11163020A | 1999-06-18 | |||
| US20200191670A1 | 2020-06-18 |
Attorney, Agent or Firm:
BEIJING BESTIPR INTELLECTUAL PROPERTY LAW CORPORATION (CN)
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