Title:
LIGHT-EMITTING DIODE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/085689
Kind Code:
A1
Abstract:
The present invention relates to a light-emitting diode package. According to one aspect of the present invention, provided is a light-emitting diode package comprising: a package substrate including a first substrate electrode and a second substrate electrode that are spaced apart from each other; a light-emitting diode chip arranged on the package substrate so that the first substrate electrode and the second substrate electrode are electrically connected; and an encapsulant which includes a fluorine compound, and which covers the light-emitting diode chip such that at least a part thereof is in contact with the light-emitting diode chip.
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Inventors:
MIN SEUNG GU (KR)
LEE YOUNG JIN (KR)
LEE YOUNG JIN (KR)
Application Number:
PCT/KR2023/016281
Publication Date:
April 25, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
SEOUL VIOSYS CO LTD (KR)
International Classes:
H01L33/54; H01L33/48; H01L33/56; H01L33/58; H01L33/62
Foreign References:
| KR20190138103A | 2019-12-12 | |||
| KR20210004548A | 2021-01-13 | |||
| KR20170104774A | 2017-09-18 | |||
| JP2021100095A | 2021-07-01 | |||
| KR20200129973A | 2020-11-18 |
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
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