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Title:
LASER EMITTING ASSEMBLY, SILICON OPTICAL INTEGRATED CHIP, AND LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/082809
Kind Code:
A1
Abstract:
A laser emitting assembly (100), a silicon optical integrated chip, and a laser device. The laser emitting assembly (100) comprises: a band-pass filter (110), a splitter (120), a first micro-ring modulator (130), a second micro-ring modulator (140) and a common waveguide (150), wherein the band-pass filter (110) filters an optical signal and outputs same; the splitter (120) performs optical splitting on the optical signal from the band-pass filter (110) to obtain first and second optical signals, part of the first optical signal being output outwards, the remaining part thereof sequentially passing through the first micro-ring modulator (130), the common waveguide (150), the second micro-ring modulator (140) and the splitter (120) and then returning to the band-pass filter (110), part of the second optical signal being output outwards, and the remaining part thereof sequentially passing through the second micro-ring modulator (140), the common waveguide (150), the first micro-ring modulator (130) and the splitter (120) and then returning to the band-pass filter (110); and the modulation direction of the first micro-ring modulator (130) in respect of the optical signal is opposite to that of the second micro-ring modulator (140) in respect of the optical signal.

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Inventors:
LI CHENLEI (CN)
ZHENG XUEZHE (CN)
Application Number:
PCT/CN2023/114556
Publication Date:
April 25, 2024
Filing Date:
August 24, 2023
Export Citation:
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Assignee:
INNOLIGHT TECH SUZHOU LTD (CN)
International Classes:
G02F1/01
Foreign References:
CN218524975U2023-02-24
CN113900312A2022-01-07
CN108923250A2018-11-30
CN112202048A2021-01-08
CN212725953U2021-03-16
US20170139237A12017-05-18
US20190058306A12019-02-21
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