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Patent Searching and Data


Title:
LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2022/255165
Kind Code:
A1
Abstract:
Provided is a laminated film capable of improving work efficiency in a process for producing a semiconductor device. The laminated film according to the present invention is such that a first separator, a first adhesive layer composed of a low-tack adhesive layer, a base material, a second adhesive layer composed of a releasable adhesive layer, and a second separator are laminated in the stated order, the 180° peeling peel strength F(1), F(2) of the first and second separators with respect to the first and second adhesive layers, the 180° peeling adhesive strength P(2) of the second adhesive layer with respect to a glass plate, and 180° peeling adhesive strength P'(2) after five minutes at 160°C (N/50 mm) satisfying the following formulas. F(2)≤F(1) P(2)≥F(1) P'(2)/P(2)<1.20P'(2)<1.00 Because "F(1)≤F(2)" in claim 1 is a typographical error for "F(2)≤F(1)" in view of the descriptions in paragraphs [0009], [0015], and [0018]-[0022], the examples, and claim 2, the examination was conducted using the reading "F(2)≤F(1)."

Inventors:
OCHI GENKI (JP)
OKITA NATSUKO (JP)
NORO HIROSHI (JP)
Application Number:
PCT/JP2022/021273
Publication Date:
December 08, 2022
Filing Date:
May 24, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J7/40; C09J133/14; C09J183/07; H01L21/301; H01L21/52
Domestic Patent References:
WO2020017556A12020-01-23
WO2020162331A12020-08-13
WO2018020939A12018-02-01
Foreign References:
JP2020122139A2020-08-13
JP2009197150A2009-09-03
JP2010222507A2010-10-07
JP2014098131A2014-05-29
JP2018120119A2018-08-02
JP2011099097A2011-05-19
JP2013166884A2013-08-29
Other References:
"HANDBOOK OF PRESSURE SENSITIVE ADHESIVE TECHNOLOGY", 1 January 1997, ISBN: 4-526-03986-1, article SATAS, DONATAS: "29.3.4 Adhesive strength", pages: 773 - 776,782, XP009541376
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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