Title:
IGBT PACKAGE HEAT DISSIPATION STRUCTURE AND MOTOR CONTROLLER USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/279590
Kind Code:
A1
Abstract:
Disclosed in the present invention are an IGBT package heat dissipation structure and a motor controller using same. The IGBT package heat dissipation structure comprises a heat dissipation substrate main body, and heat dissipation fins and electrodes respectively fixed on two sides of the heat dissipation substrate; each heat dissipation fin has an inner cavity structure; a wafer, a first DBC layer, and a second DBC layer are placed in the inner cavity; the left and right side surfaces of the wafer are respectively connected to a copper-clad layer on the right surface of the first DBC layer and a copper-clad layer on the left surface of the second DBC layer by means of a second solder layer and a third solder layer. Each electrode is separately connected to the copper-clad layer on the right surface of the first DBC layer and the copper-clad layer on the left surface of the second DBC layer. The copper-clad layer on the left surface of the first DBC layer and the copper-clad layer on the right surface of the second DBC layer are respectively connected to the surfaces of the left and right inner cavities of the heat dissipation fin by means of the first solder layer and the fourth solder layer. According to the IGBT package heat dissipation structure of the present invention, a IGBT package housing and the heat dissipation channel fins are combined, thereby reducing the package volume, multi-surface water-cooling heat dissipation is achieved, and the heat dissipation problem of a highly integrated controller IGBT is solved.
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Inventors:
LIU LEI (CN)
GU JIE (CN)
MAO JIANHUA (CN)
CHENG YONG (CN)
GU JIE (CN)
MAO JIANHUA (CN)
CHENG YONG (CN)
Application Number:
PCT/CN2021/127341
Publication Date:
January 12, 2023
Filing Date:
October 29, 2021
Export Citation:
Assignee:
HEFEI JEE POWER SYS CO LTD (CN)
International Classes:
H01L23/367; H01L23/473
Foreign References:
| CN113488445A | 2021-10-08 | |||
| JP2007053295A | 2007-03-01 | |||
| CN210805757U | 2020-06-19 | |||
| US20140098588A1 | 2014-04-10 | |||
| CN109817591A | 2019-05-28 |
Attorney, Agent or Firm:
KEYCOM PARTNERS, P.C. (CN)
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