Title:
END FACE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/210485
Kind Code:
A1
Abstract:
Provided is an end face processing device that makes it possible to reduce the burden of ensuring the tensile strength of a polishing tool such as a linear brush, and to permit use of polishing tools of a wide variety of materials and structures. An end face processing device 100 is provided with: a workpiece holding tool 110 that holds a workpiece 90 constituted of a glass substrate in a detachable manner; a second polishing tool 130 for carrying out a polishing process with respect to a concave portion 92 of the workpiece 90; and a rear face receiving tool 140 that restricts displacement of the second polishing tool 130. The second polishing tool 130 is configured by providing a polishing portion 130b constituted of a resin brush around a metallic wire-like core body 130a. In the rear face receiving tool 140, a receiving portion 142 is formed on a block-like receiving tool body 141. The receiving portion 142 is constituted of a curved face with an arc-like cross section that can accommodate the polishing portion 130b. The rear face receiving tool 140 is positioned such that the receiving portion 142 is positioned on an extension of an arc of a curvature constituting the concave portion 92. Figure 1
Inventors:
SHIMAMURA TETSUYA (JP)
Application Number:
PCT/JP2021/014883
Publication Date:
October 21, 2021
Filing Date:
April 08, 2021
Export Citation:
Assignee:
SHODA TECHTRON CORP (JP)
International Classes:
B24B29/00; A46B3/18; B24B9/00
Foreign References:
| JPH079322A | 1995-01-13 | |||
| JP2008105159A | 2008-05-08 |
Attorney, Agent or Firm:
ITO Hiroyuki (JP)
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