Title:
ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE
Document Type and Number:
WIPO Patent Application WO/2023/106670
Kind Code:
A1
Abstract:
An electronic device is disclosed. The electronic device comprises: a housing; a support member disposed inside the housing and having a connection passage formed therein; a printed circuit board disposed on the support member, and including a first region and a second region spaced apart from the first region; and a conductive pattern disposed on the support member and including a first portion and a second portion, wherein the first portion is electrically connected to a first electrode portion disposed in the first region, and the second portion is electrically connected to a second electrode portion disposed in the second region, and the first region and the second region may be electrically connected to each other through a shunt member.
More Like This:
Inventors:
LEE KYUHO (KR)
BANG YOUNGSEOK (KR)
OH JUNTAEK (KR)
YUN YONGSANG (KR)
BANG YOUNGSEOK (KR)
OH JUNTAEK (KR)
YUN YONGSANG (KR)
Application Number:
PCT/KR2022/017982
Publication Date:
June 15, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04R1/10; G06F1/16; H01Q1/44; H04R1/08; H04R3/00; H04R5/04
Foreign References:
| KR20210041572A | 2021-04-15 | |||
| CN209766631U | 2019-12-10 | |||
| KR20210099970A | 2021-08-13 | |||
| CN213124720U | 2021-05-04 | |||
| CN206313955U | 2017-07-07 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: