Title:
DIELECTRIC MULTILAYER FILM-EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/043120
Kind Code:
A1
Abstract:
A dielectric multilayer film-equipped substrate (1) is obtained by layering a first dielectric laminate film (10) and a second dielectric laminate film (20) in the stated order on a substrate (S), the first dielectric laminate film (10) being obtained by layering a first high-refractive-index film layer (a1) including TiO2, a first low-refractive-index film layer (b1) including SiO2, a first high-refractive-index film layer (a2) including TiO2, and a first low-refractive-index film layer (b2) including SiO2 in the stated order from the substrate (S) side, the second dielectric laminate film (20) being obtained by layering a second high-refractive-index film layer (a3) including Ta2O5 or Nb2O5 and a second low-refractive-index film layer (b3) including SiO2 in the stated order from the substrate (S) side, and the thickness of the first low-refractive-index film layer (1022) that is positioned farthest from the substrate (S) in the first dielectric layered film (10) being 30 nm or greater.
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Inventors:
TAKAHOSHI HIDEAKI (JP)
ARAE TOMOYUKI (JP)
NISHIKAWA YASUHISA (JP)
FUJIWARA TERUO (JP)
ARAE TOMOYUKI (JP)
NISHIKAWA YASUHISA (JP)
FUJIWARA TERUO (JP)
Application Number:
PCT/JP2023/029281
Publication Date:
February 29, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
G02B1/115; B32B7/023; B32B9/00; C03C17/34; G02B5/28
Foreign References:
| JP2022072420A | 2022-05-17 | |||
| JP2012118536A | 2012-06-21 | |||
| JP2011237472A | 2011-11-24 | |||
| JP2006171332A | 2006-06-29 | |||
| JP2002014203A | 2002-01-18 | |||
| JP2002040237A | 2002-02-06 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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