Title:
CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/100761
Kind Code:
A1
Abstract:
Provided is a curable resin composition which includes: at least one resin selected from the group consisting of a polyimide precursor, and a polybenzoxazole precursor; a basic compound; and a solvent, wherein the composition has a pH of 7.00-10.00. Also provided are a method for producing the curable resin composition, a cured film obtained by curing the curable resin composition, a laminate including the cured film, a method for producing the cured film, and a semiconductor device including the cured film or the laminate.
Inventors:
NIHASHI WATARU (JP)
Application Number:
PCT/JP2020/043002
Publication Date:
May 27, 2021
Filing Date:
November 18, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08K5/17; H01L23/14; C08K5/5419; C08L79/04; C08L79/08; G03F7/004; G03F7/027; G03F7/075; G03F7/20; H01L23/29; H01L23/31
Foreign References:
| JP2010108725A | 2010-05-13 | |||
| JP2011512552A | 2011-04-21 | |||
| JP2016017145A | 2016-02-01 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE
Next Patent: ROLLOVER RISK PRESENTATION DEVICE AND ROLLOVER RISK PRESENTATION METHOD
Next Patent: ROLLOVER RISK PRESENTATION DEVICE AND ROLLOVER RISK PRESENTATION METHOD