Title:
CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/085091
Kind Code:
A1
Abstract:
This conductive paste contains: a conductive powder mainly composed of copper; a glass frit; a binder resin; and an organic solvent. The conductive paste is characterized in that: the conductive powder mainly composed of copper has, in a laser diffraction particle size distribution measurement, a volume-based cumulative 50% particle size distribution D50C of 0.3-4.5 μm , a ratio of the average major axis X to the average minor axis Y of 1.0-3.0, a ratio of the average major axis X to the average thickness Z of 1.1-9.0, and a ratio of the average major axis X to the average thickness Z of 1.1-9.0; and the glass frit has, in a laser diffraction particle size distribution measurement, a volume-based cumulative 50% particle size distribution D50G of 0.3-2.0 μm. According to the present invention, a thin and dense terminal electrode having excellent continuity, even when fired at a low temperature, can be formed while maintaining high productivity. Moreover, an electronic component having a thin and dense terminal electrode having excellent continuity, even when fired at a low temperature, can be manufactured while maintaining high productivity.
Inventors:
ESAKI SOICHIRO (JP)
AKIMOTO YUJI (JP)
AKIMOTO YUJI (JP)
Application Number:
PCT/JP2023/037247
Publication Date:
April 25, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
SHOEI CHEMICAL IND CO (JP)
International Classes:
H01B1/22; H01G4/30
Foreign References:
| JP2018181672A | 2018-11-15 | |||
| JP2006004734A | 2006-01-05 | |||
| JP2012092432A | 2012-05-17 | |||
| JP2004315835A | 2004-11-11 | |||
| JP2007081351A | 2007-03-29 |
Attorney, Agent or Firm:
SAKAI, Masami et al. (JP)
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