COMPOSITE ELECTRONIC COMPONENT

Title:

COMPOSITE ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2024/024160

Kind Code:

A1

Abstract:

[Problem] To enhance freedom of design and prevent the joining of two coil patterns, in a composite electronic component having a structure in which an electronic component is embedded. [Solution] A composite electronic component 1 comprises: coil patterns 41, 42 that are provided to a conductor layer C3 and are arranged with a gap G1 therebetween, without having a ground pattern interposed therebetween; a ground pattern GP that is provided to a conductor layer C4 and overlaps with the gap G1 in plan view; an electronic component 2 that is embedded in an insulation layer 12; and a plurality of external terminals.

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Inventors:

SHIMAMURA TAKUYA (JP)
ABE TOSHIYUKI (JP)
TSUYUTANI KAZUTOSHI (JP)
CHEN LIYI (JP)

Application Number:

PCT/JP2023/010550

Publication Date:

February 01, 2024

Filing Date:

March 17, 2023

Export Citation:

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Assignee:

TDK CORP (JP)

International Classes:

H01F27/00; H01F17/00; H05K1/16; H05K3/46

Domestic Patent References:

WO2017159282A1

2017-09-21

Foreign References:

JP2000049015A

2000-02-18

Attorney, Agent or Firm:

WASHIZU Mitsuhiro et al. (JP)

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