Title:
CHIP-TYPE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/075404
Kind Code:
A1
Abstract:
Provided is a chip-type electronic component that is less likely to cause separation of a spacer and a mounting substrate. A chip-type electronic component 1 of the present invention comprises a multilayered ceramic capacitor 1A and spacers 10. The multilayered ceramic capacitor 1A comprises: a stack 2 that includes internal electrode layers 5 and dielectric layers 4 that are alternately disposed; and external electrodes 3. When the two surfaces of the stack 2 opposing each other in the multilayered direction are capacitor main surfaces A, the two surfaces thereof opposing each other in the width direction are capacitor side surfaces B, and the two surfaces thereof opposing each other in the length direction are capacitor end surfaces C, the external electrodes 3 are respectively provided on the capacitor end surfaces C. The spacers 10 are disposed on both sides in the length direction of the capacitor main surface A on the mounting substrate side of the multilayered ceramic capacitor 1A. When the two surfaces opposing each other in the multilayered direction of each of the spacers 10 are spacer main surfaces AS, a recess 11 is formed in the surface of the spacer main surface AS on the mounting substrate side.
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Inventors:
YASUDA TATSUNORI (JP)
KUROKAWA KAZUKI (JP)
OONO AKIRA (JP)
KUROKAWA KAZUKI (JP)
OONO AKIRA (JP)
Application Number:
PCT/JP2023/029583
Publication Date:
April 11, 2024
Filing Date:
August 16, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30; H01C7/02; H01C7/04; H01C7/10; H01F17/00; H01G4/228
Domestic Patent References:
| WO2018101405A1 | 2018-06-07 |
Foreign References:
| JP2022099069A | 2022-07-04 | |||
| JP2018190952A | 2018-11-29 | |||
| JP2007081004A | 2007-03-29 | |||
| JPH0969401A | 1997-03-11 |
Attorney, Agent or Firm:
KATO Ryuta et al. (JP)
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