Title:
CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/204167
Kind Code:
A1
Abstract:
A ceramic circuit board according to an embodiment comprises a ceramic substrate and metal sheets joined to either surface of the ceramic substrate. At least one of the metal sheets joined to either surface of the ceramic substrate is a cooling path metal sheet having a cooling path part. The thickness of the ceramic substrate is preferably less than the thickness of the cooling path metal sheet. It is preferable that the ceramic substrate comprises a first ceramic substrate and a second ceramic substrate which is joined to a metal sheet joined to the first ceramic substrate, wherein one surface of the second ceramic substrate is joined to a cooling path metal sheet joined to the first ceramic substrate, and a metal sheet is joined to the other surface of the second ceramic substrate.
Inventors:
UENO TOSHIHIDE (JP)
Application Number:
PCT/JP2023/015288
Publication Date:
October 26, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
TOSHIBA KK (JP)
TOSHIBA MATERIALS CO LTD (JP)
TOSHIBA MATERIALS CO LTD (JP)
International Classes:
H01L23/12; H01L23/13; H01L23/36; H05K1/02; H05K7/20
Foreign References:
| JP2005317890A | 2005-11-10 | |||
| JPH1117086A | 1999-01-22 | |||
| JP2003086747A | 2003-03-20 | |||
| JP2012178513A | 2012-09-13 |
Attorney, Agent or Firm:
TOKYO INTERNATIONAL PATENT FIRM (JP)
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