Title:
CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2023/003308
Kind Code:
A1
Abstract:
This camera module comprises: a first body including a lens; a second body coupled to the first body; and a printed circuit board which is disposed in a space inside the first body and the second body and includes an image sensor. The first body includes: a first protrusion protruding downward from the lower surface; and a first coupling groove located inside the first protrusion. The second body includes: a second protrusion protruding upward from the upper surface and facing the first coupling groove; and a second coupling groove located outside the second protrusion and facing the first protrusion. Adhesive members are arranged on the inner surface, the upper surface, and the outer surface of the second protrusion, and the second protrusion has one or more grooves or holes for arranging the adhesive members.
Inventors:
HAN SANG YEAL (KR)
PARK JE KYUNG (KR)
PARK JE KYUNG (KR)
Application Number:
PCT/KR2022/010474
Publication Date:
January 26, 2023
Filing Date:
July 18, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
G03B17/08
Foreign References:
| KR20210057414A | 2021-05-21 | |||
| KR20190063028A | 2019-06-07 | |||
| KR20200108155A | 2020-09-17 | |||
| KR20180118459A | 2018-10-31 | |||
| JP2008035215A | 2008-02-14 |
Attorney, Agent or Firm:
JIN, Cheon Woong et al. (KR)
Download PDF:
Previous Patent: CELL ASSEMBLY
Next Patent: SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DRIVING DOOR ASSEMBLY
Next Patent: SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DRIVING DOOR ASSEMBLY